Advanced Semiconductor Engineering (ASE), Amkor Technology and Siliconware Precision Industries (SPIL) – the world's leading packaging and testing houses – have all set higher capex budgets for 2012 with a heavy emphasis on expanding capacity for high-end processes targeting mainly advanced communications chips, such as wafer-level packaging, through silicon via (TSV) and other 3D IC packaging, and copper pillar bumping.
ASE has budgeted US$800 million or more in capex for 2012, a 2.5% increase from the US$780 million allocated in 2011. The firm disclosed that 30% of the amount will be used to invest in new equipment for flip-chip packaging.
Amkor has guided a capex of US$500 million in 2012, a 10% rise from US$453 million in 2011 while SPIL estimated capex at NT$17.5 billion (US$583 million), a more than 50% jump from NT$11 billion in 2011. In total, combined capex of the three major IC backend firms will top US$1.8 billion in 2012.
In addition, ASE, Amkor and SPIL have all projected single-digit sequential growth in their sales in the third quarter of 2012.
ASE expects its ATM (assembly test and material) business to post a 4-6% on-quarter increase in shipments for the third quarter with flat ASPs, while Amkor predicted a 2-9% sequential growth in revenues. SPIL forecast third-quarter sales would rise 2-5% sequentially.
ASE indicated previously that its planned new capacity is to be built according to customer demand over the long term. The firm expressed caution about the supply chain's conservative attitude toward inventory replenishment.
Rival Amkor noted its anticipated growth for the third quarter "is somewhat slower than anticipated due to worldwide macroeconomic uncertainties, the delay in the ramp of 28nm wafer supply and the softness in end market demand by the less dominant OEMs that sell smartphones and tablets."
Article translated by Jessie Shen
