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Behind CoWoS (part 1)—How a 0% yield crisis led to TSMC's first advanced packaging win

Julian Ho, interview
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Credit: DIGITIMES

In a recent interview on the DIGITIMES podcast, Dr. Shin-Puu Jeng, chairman of the International Microelectronics and Packaging Society (IMAPS) and a former longtime TSMC advanced packaging executive, reflected on the early development of CoWoS...

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