Research_PC

REALTIME NEWS

LG Innotek tackles glass substrate microcrack issue as 2028 production race heats up

Huawei Qiankun turns 2 million cars into its next assisted-driving advantage

Electric Vehicles

SEMIFIVE begins HyperAccel chip production on Samsung 4nm as capacity tightens

Apple yields to memory suppliers in historic strategy shift, with Kioxia tipped as NAND long-term agreement recipient

India's HCLTech opens semiconductor lab in Bengaluru to serve global chip supply chains

Home Tech Semiconductors

Exclusive Interview: WG Tech sees a faster route for TGV beyond displays

Siu Han

Siu Han

, interview

Sep 9, 2026, 10:39 0

WG Tech CEO Awa Chang. Credit: DIGITIMES

WG Tech (Jiangxi) Group is accelerating its shift from display glass into semiconductor applications, targeting through-glass via (TGV) substrates for optical communications and advanced packaging as AI demand expands.

The article requires paid subscription. Subscribe Now

LOGIN

Email address

Password

Keep me signed in

Keep me signed in

Some subscribers prefer to save their log-in information so they do not have to enter their User ID and Password each time they visit the site. To activate this function, check the 'Keep me signed in' box in the log-in section. This will save the password on the computer you're using to access the site.

Note: If you choose to use the log-out feature, you will lose your saved information. This means you will be required to log-in the next time you visit our site.

Enterprise first-time login?

Forgot your password?

Create your free account

Select premium stories & daily editor picks.
Leverage AI summaries for instant insights.
Receive tech briefings & newsletters.
Track financials & stock data of Taiwan tech.

No credit card required

GlobalExhibition

IDA Partners with Taiwan's Semiconductor Industry to Advance Global Talent Strategy

Semicon_TW

MOST-READ
7 DAYS NEWS