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Home Tech Semiconductors

Chiayi Science Park Phase 2 breaks ground for advanced packaging hub

Rebecca Kuo

Rebecca Kuo

, Chiayi

Jul 13, 2026, 12:47 0

Credit: STSP Bureau

The second phase of Chiayi Science Park has officially broken ground on a site of about 90 hectares, with TSMC leading the development of an industrial cluster centered on advanced packaging...

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EDOM Accelerates Edge AI Deployment with NVIDIA Technologies

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