Research_Server_HPC

REALTIME NEWS

Commentary: How iPad Air became a catalyst for IT OLED expansion

Tomorrow's Headlines

Taiwan IC design firms see a broad rebound in automotive chips

Tomorrow's Headlines

Chinese automakers pivot to humanoid robots as policy support shifts

Tomorrow's Headlines

LG buys Mexico parts plant to cut TV manufacturing costs

Tomorrow's Headlines

China equipment localization weighed on South Korean suppliers' revenue in 2025

Tomorrow's Headlines

Home Tech Semiconductors

BOE, Corning target glass substrates for AI chip packaging

Staff reporter, Taipei

May 22, 2026, 09:28 0

BOE chairman Chen Yanshun. Credit: BOE

BOE Technology, China's leading display panel maker, is expanding its push into new businesses beyond panels...

The article requires paid subscription. Subscribe Now

LOGIN

Email address

Password

Keep me signed in

Keep me signed in

Some subscribers prefer to save their log-in information so they do not have to enter their User ID and Password each time they visit the site. To activate this function, check the 'Keep me signed in' box in the log-in section. This will save the password on the computer you're using to access the site.

Note: If you choose to use the log-out feature, you will lose your saved information. This means you will be required to log-in the next time you visit our site.

Enterprise first-time login?

Forgot your password?

Create your free account

Select premium stories & daily editor picks.
Leverage AI summaries for instant insights.
Receive tech briefings & newsletters.
Track financials & stock data of Taiwan tech.

No credit card required

SK hynix Accelerates 40 Trillion won Share Repurchase and Cancellation

reportAIglasses

MOST-READ
7 DAYS NEWS