ASE's CoPos advanced packaging accelerates as Skytech and CMIt boost equipment deliveries

, Hsinchu

Apr 19, 2026, 06:44 0

Credit: DIGITIMES

AI and high-performance computing (HPC) are driving increasingly stringent chip performance demands, marking a pivotal shift in advanced packaging technology from traditional wafers to large-size panels. Semiconductor equipment leader Skytech's CEO George Yi...

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