Samsung Electronics has been in active discussions with Samsung Electro-Mechanics (Semco), Japan's Ibiden, and Shinko Electric Industries regarding collaboration on semiconductor glass substrates. However, reports indicate that they have not yet advanced to formal sample evaluation because of Samsung's assessment of the technology and market potential of glass substrates.
ZDNet Korea, citing industry sources, stated that Samsung began these discussions on glass-substrate sample evaluations one to two years ago as preliminary steps toward adopting glass substrates for advanced packaging technologies. However, there is recent evidence that suggests Samsung regards glass substrates as just one of many next-generation technology options and has yet to form concrete commercialization plans.
Furthermore, SEM, Ibiden, and Shinko have not delivered samples that meet Samsung's required performance standards. The two Japanese substrate makers did not meet Samsung's required size and specifications for formal samples, and SEM has yet to progress to formal sample testing.
Although glass substrates offer superior performance compared with existing substrates, they still face several technical challenges. For example, cracks can easily occur during cutting and through-glass-via (TGV) drilling. Differences in physical properties between the glass substrate and the mounted chips can also lead to defects.
More importantly, there is no guarantee of stable demand. The primary motivation for adopting glass substrates is to address warpage issues, but warpage can be solved without switching to glass, leading many engineers to question the necessity of investment. The uncertainty surrounding glass substrates and the risk of R&D failure have slowed practical development efforts.
Nevertheless, ET News previously indicated that Samsung planned to adopt glass substrates in semiconductor manufacturing starting in 2028. Glass substrates are considered next-generation components essential for high-performance semiconductors such as AI chips, and they have the potential to become the next industry game changer.
Article translated by Emily Kuo and edited by Jack Wu
