STATS ChipPAC CTO: Scaling innovation defines AI and HPC's next era

Henry Hsu, Singapore; Joseph Chen, DIGITIMES Asia Thursday 30 October 2025 0

Credit: DIGITIMES

IK Shim, Chief Technology Officer of STATS ChipPAC, opened the 2025 Advanced Packaging Developers Conference (APDC) with a clear message: the semiconductor industry's greatest challenge is no longer invention itself, but turning invention into a manufacturable,...

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