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Unified packaging standards seen as key to meeting AI and automotive demands

Flora Wang, Taipei; Jingyue Hsiao, DIGITIMES Asia Wednesday 29 October 2025 0

Devan Iyer. Credit: DIGITIMES

Taiwan's printed circuit board (PCB) manufacturers and outsourcing semiconductor assembly and test (OSAT) providers are positioned for significant growth driven by artificial intelligence (AI), 5G/6G communications, and automotive electronics. However,...

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