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OCP Summit: Foxconn Interconnect Technology showcases high-speed and cooling innovations

Ninelu Tu, Taipei; Jingyue Hsiao, DIGITIMES Asia Wednesday 15 October 2025 0

Credit: DIGITIMES

Foxconn Interconnect Technology (FIT) unveiled its latest high-speed interconnect and thermal management solutions aimed at enhancing 224G generation transmission and energy efficiency at the 2025 Open Compute Project (OCP) Global Summit in San Jose,...

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