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Huawei patents SiC cooling tech to power next-gen AI chips

Staff reporter, Taipei; Levi Li, DIGITIMES Asia Sunday 21 September 2025 0

Huawei patents filed with China’s IP office reveal new silicon carbide thermal applications. Credit

Huawei has disclosed two new patents in China targeting advanced cooling solutions for AI chips, highlighting the rising urgency around thermal management as chip power consumption continues to climb. The filings, revealed by China's National Intellectual...

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