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Nvidia to adopt CoWoP advanced packaging for 2027 AI GPU, reshaping PCB supply chain

Flora Wang, Taipei; Jingyue Hsiao, DIGITIMES Asia Friday 22 August 2025 0

Credit: DIGITIMES

Nvidia Corporation is set to implement a new advanced packaging technology called Chip-on-Wafer-on-Platform PCB (CoWoP) for its next-generation GR150 AI GPU, expected to launch in 2027. This approach could significantly impact the semiconductor packaging...

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