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Taiwan lab, chip gear maker develop laser tech to speed SiC processing

Bryan Chuang; Vyra Wu, DIGITIMES Asia Wednesday 25 June 2025 0

Credit: DIGITIMES

Taiwan's National Applied Research Laboratories and semiconductor equipment manufacturer Deuvtek have developed infrared nanosecond laser technology for SiC wafer grinding that cuts processing time and reduces breakage rates. The system is being tested...

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