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Innolux CEO responds to FOPLP delays

Rebecca Kuo

Rebecca Kuo

, Taipei

Apr 17, 2025, 14:38 0

Innolux Chairman and CEO, Jim Hung. Credit: DIGITIMES

Innolux, a major display panel maker, is intensifying its push into Fan-Out Panel Level Packaging (FOPLP), a next-gen semiconductor packaging technology...

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EDOM Accelerates Edge AI Deployment with NVIDIA Technologies

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