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Phoenix Pioneer sees a bright outlook for 2025 amid its transition to advanced packaging substrates

Flora Wang, Taipei

Dec 12, 2024, 10:18 0

Credit: Phoenix Pioneer

Innovative IC substrate manufacturer Phoenix Pioneer Technology is undergoing a strategic transformation into advanced packaging. The company is developing cutting-edge xQFN lead frames and fan-out panel-level packaging (FOPLP) for gallium nitride (GaN) power...

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