Rapidus gears up for advanced packaging and chiplet technologies as it races to 2nm production

Chiang, Jen-Chieh, Taipei; Willis Ke, DIGITIMES Asia 0

Credit: AFP

Japan's semiconductor foundry startup Rapidus, now on a mission to mass produce 2nm chips by 2027, is developing advanced packaging and chiplet technologies, with a particular focus on interposer technology crucial for connecting chips with substrates...

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