IC packaging materials demand to hit bottom in 1Q23, but recover through rest of 2023, says CWE chair

Julian Ho, Taipei; Rodney Chan, DIGITIMES Asia 0

CWE chairman Canon Huang. Credit: DIGITIMES

The IC packaging materials sector will definitely hit rock bottom in the first quarter of 2023, but will then recover steadily in the rest of year, according to Chang Wah Electromaterials (CWE) chairman Canon Huang.

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