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Samsung consolidates robot teams and weighs standalone HX division

China's AI supernode race seeks systems edge through optics, packaging, and cloud scale

BOE expands into glass-core packaging, solar cells and optical interconnects

China's solar slump deepens, raising warning signs for energy storage and electric vehicles

Electric Vehicles

India's smartphone shipments fall as memory costs bite

Niche demand drives SLC NAND prices up nearly tenfold, opening further gains for Taiwan suppliers

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Pat Gelsinger: Intel missed GPU boom, warns Taiwan energy risk

Memory shortage could turn into a glut by 2028 as chipmakers expand

Microsoft expands Azure partnership with AMD ahead of Helios AI system launch

AI memory shortage may lift smartphone prices in 2H26

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Zeiss claims China cannot bypass EUV with advanced packaging

Tomorrow's Headlines

Samsung reportedly bets on Wide Fold as Apple’s foldable iPhone nears

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LITEON Showcases AI at COMPUTEX Panel Featuring NVIDIA, Infineon, GIGABYTE

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