ASE, Unimicron to provide packaging, related substrates for new Apple M2 chip

Julian Ho, Taipei; Eifeh Strom, DIGITIMES Asia 0

Credit: Apple

Taiwan-based ASE Technology and Unimicron Technology have both seized flip chip ball grid array (FC-BGA) packaging and related substrate orders for Apple's just unveiled M2 processors, along with Amkor Technology and Samsung Electro-Mechanics (Semco),...

The article requires paid subscription. Subscribe Now