While demand for its 7nm manufacturing node has been strong, TSMC is ready to move its more advanced 5nm process to volume production in first-half 2020 - probably as early as March. The foundry house has been fast developing advanced chipmaking processes. It has also been keen on developing new packaging technology in support of its task to extend the relevance of Moore's Law.
TSMC to volume produce 5nm chips as early as March 2020: TSMC is expected to move its more advanced 5nm process technology to volume production as ealy as March, according to industry sources.
TSMC may join forces with OSAT firms to build SoIC ecosystem: In the era of heterogeneous chips integration, Taiwan Semiconductor Manufacturing Company (TSMC) is expected be among global top-3 players in the advanced 3D IC packaging field along with Intel and Samsung, but the company is also likely to build an SoIC (system-on-integrated-chips) ecosystem in cooperation with Taiwan-based OSAT (outsourced semiconductor assembly and test) firms, according to industry sources.
