Yangtze Memory enters 64-layer 3D NAND chip production

Taipei, Wednesday, November 13, 2019 01:04 (GMT+8),

21°C

中文繁體 | 簡體

We have recently changed our search engine. Check the Advanced options to learn the new search rules.

Asian Edge: On the Frontline of the ICT World

Bits + chips

Yangtze Memory enters 64-layer 3D NAND chip production

Siu Han, Taipei; Jessie Shen, DIGITIMES

Tuesday 3 September 2019

China's Yangtze Memory Technologies (YMTC) has kicked off volume production of 64-layer 256Gb TLC 3D NAND chips, according to indsutry sources.

The article you are trying to open requires News database subscription. Please sign in if you wish to continue.

Sponsored links

Taiwan semiconductor foundry sector, 2Q19
Taiwan-based semiconductor foundries showed recovery in second-quarter 2019.
Global server shipment forecast and industry analysis, 2019
For 2019, Taiwan-based server shipments will pick up another 7% on year.
Global AP demand forecast, 2017-2022
Worldwide shipments of smartphone application processors are expected to fall.

Global mobile device shipment forecasts, 2019 and beyond: Smartphones, notebooks and tablets

© 2019 DIGITIMES Inc. All rights reserved.
Please do not republish, publicly broadcast or publicly transmit content from this website without written permission from DIGITIMES Inc. Please contact us if you have any questions.

Members only