Tsinghua Unigroup's chipmaking arm Unisoc expects to have its Ivy 510-series 5G solution featured in customers' terminal devices that are slated for launch by the end of 2019.
Unisoc introduced its 5G technology platform Makalu and Ivy 510-series 5G modem chip at the MWC in early 2019. The Ivy 510 solution will be featured in customers' CPE and module products scheduled for launch in China later in the second half of 2019, according to the chipmaker.
Unisoc said that it believes CPE and module products will be the first applications driving 5G chip demand growth, with its Ivy 510 focused initially on the China market.
Unisoc has also had its 5G chip solution validated for 26GHz mmWave networks, the chipmaker continued. Unisoc added it is gearing up to play a role in the global 5G chipset market.
Article translated by Jessie Shen
