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Major IC packagers step up 2012 capex

Ingrid Lee, Taipei; Jessie Shen, DIGITIMES Monday 6 August 2012 0

Advanced Semiconductor Engineering (ASE), Amkor Technology and Siliconware Precision Industries (SPIL) – the world's leading packaging and testing houses – have all set higher capex budgets for 2012 with a heavy emphasis on expanding capacity...

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