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Taiwan’s gold bumping service providers schedule capacity expansions for 2006

Amy Lee, Taipei; Jessie Shen, DIGITIMES Asia Tuesday 7 February 2006 0

Taiwan-based gold-bumping service providers – Chipbond Technology, International Semiconductor Technology (IST), Fupo Electronics and ChipMOS Technologies – all plan to expand their six- and eight-inch gold-bumping capacities this year.

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