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REALTIME NEWS

Apple keeps iPhone Duo in China, exposing limits of India's phone supply chain

Meta's Muse faces security scrutiny over macOS zero-day, human-agent test

China's Micro Han Xin code takes aim at Data Matrix in semiconductor traceability

Beyond ASML: China rethinks EUV race with light-source strategy

India roundup: India's tech ambitions widen from electronics manufacturing to chips, cloud and talent

Sep

27

2026

Keysight pushes design-to-deployment standard for AI cluster validation

Meta Muse fuels agentic AI demand, tightening CPU supply

Nvidia's push for personal AI computers points to a broader shift toward on-premise compute

China wields LCD pricing power as OLED patent war with Samsung heats up

Beijing escalates domestic chip drive with Broadcom audits

South Korea's 300mm research gap: Daejeon pitches an open fab as a US$1.46 billion fix

Chinese automakers tighten control over supply chains as margins shrink

Sep

26

2026

US and Chinese accounts of Xi's Washington visit agree on the framework, not the fine print

DIGITIMES Insight: China's memory makers seek scale, funding to close the gap with global leaders

Interview: Taiwan's H2U helps companies manage employee health with AI, eyes third markets with South Korea

Samsung foundry recovery gains pace, but 2nm, Taylor fab remain hurdles

Wi-Fi 7 drives enterprise network refresh as channel inventories normalize

SpaceX's AI-in-space bet is worth trillions, but space data centers won't be ready until the 2030s

Acer, Phison split on DRAM outlook as PC memory supply eases

Sep

25

2026

Akamai plans US$5.5 billion cloud buildout after US$11.6 billion Anthropic deal

Singapore brands its chip sector as it tries to move up from manufacturing

Dutch PM presses US to avoid tighter ASML China curbs

Trump-Xi summit leaves rare-earth issue unresolved amid yttrium supply squeeze

Trump-Xi state dinner draws tech titans but no Chinese CEOs

Trump, Xi back AI talks as hotline details remain unclear

Samsung, SK Hynix in the running for PS6 GDDR7 orders

BOE supplies panel for LG's 5K Mini LED gaming monitor

China's autonomous-driving suppliers confront the limits of software moats

CPC, Taipower pay premiums to secure energy supplies, face financial strain

Taiwan keeps door open for Chinese parts in drones

Bright LED Electronics rides PCBA rebound to double-digit growth

Interview: Intel director talks physical AI, business models, and robotics' future

Interview: GMI Cloud bets on Taiwan as a proving ground for global AI expansion

From ISM 1.0 to Semicon 2.0—India's chip subsidy overhaul draws early interest, raises the bar for investors

Rockets are booked until 2029, and suppliers won't expand without firm orders

Sep

24

2026

Microsoft to invest US$10B in Middle East AI infrastructure, despite war risks

Anduril's Taiwan supply chain to grow 15-fold in 2026

Taiwan's homegrown trainer program ends with 66 Brave Eagles delivered

Honda eyes Ohio hybrid plant amid pivot to North America

Grab turns Taiwan into a launchpad for Southeast Asia expansion

ASRock Industrial revenue jumps 95% in 1H26 on North America deal

CXMT gains ground in DRAM as Samsung, SK Hynix shift more capacity to HBM

LG sharpens focus on data centers, robotics, chip materials

AI drives Episil GeSi, PMIC growth

China AI's new moat: low-cost models meet a rapidly localising hardware stack

Peking University Dean's rare Intel China appearance hails AI-plus edge adoption

Yusin Malaysia plant to fully ramp up by 4Q26

United Renewable Energy eyes US plant, space-based solar power in revenue push

Chinese foundry CanSemi seeks US$918M ChiNext listing

Cadence, Synopsys certify TSMC A14 design flows ahead of 2028 production

Alibaba Cloud accelerates AI infrastructure buildout with 20GW target, eight-market expansion

Nscale's biggest customer: a Singapore unit with US$1,000 in capital, owned by ByteDance's AI brand holder

Meta stretches its glasses lineup from US$249 to US$1,299.99 as rivals close in

ASML system sales in Europe remain at zero as EU debates Chips Act 2.0

South Korea chip, panel lines stay on as AI, iPhone demand surges

Beijing Eswin heads for HK IPO as RISC-V growth shifts to autos, industrial chips

Qualcomm sticks with TSMC for both 2nm Snapdragon flagships as Samsung steps up foundry push

Qualcomm splits flagship mobile SoCs into more tiers

IEI sees network security, video growth through 2028

Commentary: Apple's M8 Ultra AI server plan could pull Apple Silicon into Nvidia's enterprise infrastructure game

Samsung reportedly shifts sub-10nm DRAM roadmap toward hybrid bonding

Xi-Trump summit masks AI rift as Chinese AI leaders stay away

Huawei founder Zhengfei Ren reappears in Shenzhen — Dongfeng smart vehicle alliance moves into focus

Qualcomm pushes Snapdragon PCs further into Linux, GoogleBook as AI shifts to the device edge

LG Display scraps Nanjing automotive LCD module sale to Top Run

TSMC locks in 3-6% wafer out price hikes for 2027

Skoda's top earner CEO jumps to Volvo, rattling Volkswagen Group

Eternal Materials eyes 2H26 peak season as precision equipment, advanced packaging shipments rise

Qualcomm bets on earphones as the voice gateway for personal AI

Anthropic joins OpenAI, Google DeepMind in Singapore

Taiwan's Yusin pivots China OE brake pad business from BYD to JV automakers

Anthropic brings in Accenture to audit AI safety

Qualcomm adopts 'offset PoP' packaging to cool new flagship phone SoC

Xi's US visit stirs alarm over a possible Chinese auto push into America

Garmin drops Micro LED after 1 year, returns to OLED

India reportedly probes LG, Samsung over duties on OLED TV display parts

Alibaba Zhenwu V900 joins Huawei Ascend 960 in race to fill Nvidia's China AI compute gap

Supermicro begins shipping Nvidia Vera Rubin NVL72 AI racks

Qualcomm's PickNik deal brings robotics software to its edge AI push

Intel puts CPU-GPU coordination at center of agentic AI strategy

Trump-Xi pre-summit watch: H20 setbacks and Ascend gains reshape China's Nvidia calculus

Industrial software giants race to build industry world models

How Apple's iPhone Duo uses a 10-layer architecture to minimize crease

Powertech targets quarterly growth in 2026, eyes record high

AUO unveils EPS 2030 blueprint linking sustainability to business value

GMI AI compute leasing business sells out in US as big users lock in long contracts

SK Hynix Indiana HBM plant faces lawsuit

Trump-Xi pre-summit watch: China charts a sovereignty-first path for frontier AI

OUCC sees semiconductor chemical shipments ramping up in 2027

Microsoft reframes AI ROI calculations, keeps in-house ASICs for internal use

ASRock Industrial's game-streaming win signals longer revenue tail, but supply risks remain

LSTC links with Rapidus to revive Japan's advanced chipmaking

AMD pushes ROCm for agentic workloads while Intel holds on to OpenVINO

Sep

23

2026

US, China diverge on AI guardrails ahead of Trump-Xi summit

SKC raises Absolics stake to 82% as glass substrates remain in testing

Engineering over panic: Jensen Huang's pragmatic vision for the future of AI

Vivo launches camera monitor accessory, stoking panel demand

Foxtron maps overseas expansion as customers seek full EV line-up

With Xi's Washington visit incoming, trade data show how the tariff war has reshaped US-China tech flows

YMTC wins German injunctions against Micron in latest round of NAND patent battle

Automotive display growth shifts to HUDs, passenger screens

LG Electronics, Microsoft enter partnership on AI data centers, physical AI

Samsung Display explores halftone black PDL tech to cut OLED production costs

Samsung LPDDR6 validated by Qualcomm for next-gen Snapdragon platform

Qualcomm and Google eye Agentic AI, expand partnership to GoogleBook, automotives

Biwin Storage commits US$672M to double down on 2.5D packaging, compute-memory integration

China's BeiDou eyes US$150 billion industry scale with AI, services at the core

ZDT prices US$800M ECB to expand AI server PCB push

Hotai expands MaaS push with FunNow stake

Taiwan's Master Bus scales 450 kW direct-drive motor for the intercity EV market

Taiwan tire maker Cheng Shin turns 'virtual tires' into an EV development weapon

Hermes-Epitek eyes CPO test revenue in 2027

LG Energy enters Nvidia's ecosystem as it pivots batteries to data centers

DeepSeek, Moonshot, the hidden cost of routing China's AI through Claude

Hygon takes China's CPU ambitions beyond servers, into physical AI

Gigabyte's Giga Computing sets up AI factory in Taiwan to accelerate rack validation

Nvidia's 800V power shift hands Taiwan's capacitor makers a new AI segment

GLT pivots into life sciences with US-patented precast gels

Acer defends Europe's biggest PC market with top-two gaming rank in Germany

China, Japan dominate over 90% of OLEDoS market, threatening South Korea's panel leadership in the AI era

China Steel expands recycled steel into EV motor market amid growing low-carbon demand

Qualcomm launches dual Snapdragon flagship platforms for Xiaomi, Honor

Nexperia China turns 12-inch wafers into the backbone of its chip supply-chain reset

Sharp reportedly to develop universal satellite antenna for multi-network connectivity

Meta's Muse gains users as human support raises privacy questions

CME Group's GPU futures debut stalls as CFTC flags concerns

Episil says AI demand marks structural shift in semiconductor epitaxy

SK hynix's venture arm moves beyond memory into optical interconnect and system software

Li Auto opens Mach chips, SiC modules to external customers

Qualcomm's agentic AI era begins with smartphones and new HBC architecture

India's Dixon looks beyond smartphones to crack global EMS top 10

Commentary: Zhengfei Ren rumors expose a deeper chill across China's tech sector

Einride builds its next autonomous truck on Nvidia Hyperion as the gap between fleet, driverless fleet stays wide

MediaTek, Qualcomm target Googlebook with Arm push

US energy storage faces a costly China battery exit

Trump rejects global AI controls, urges US to press ahead with "superintelligence"

US-based Swarmer bets up to US$224M on Ukrainian combat robot maker Ratel

Taiwan's August export orders top US$100 billion as overseas production edges up

Apple delays 20th-anniversary iPhone display upgrades

Acbel targets Europe's fast-charging market with new high-power DC modules

Malaysia reviews data centre benefits after 40-plus 2026 applications

Taiwan courts Indian IIT chief in bid to boost chip talent ties

CMC expects record 4Q revenue amid expanding model lineup

Anthropic and OpenAI both cut frontier model prices, ten days after calling for a slowdown

Analysis: Foxconn's EV push moves beyond demo and toward scale

Europe industrial controls rebound lifts Higgstec's 1H26 growth

ASRock's center of gravity moves from motherboards to AI servers

Taiwan uses AI to close drone thermal imaging gap

Taiwan finds way to turn waste LCD glass and road debris into high-value materials

Win Semiconductors expands optical communications capacity with DUV tools

LG Display starts 720Hz gaming OLED mass production

Seven Chinese AI companies hit US$10.7 billion ARR, but the harder race is paying for scale

Ascend 950 clears higher security bar in China's latest chip assessment: who else qualified?

Lightmatter launches an optical module that cuts AI cluster fiber in half

SK moves three veteran execs to SK Hynix amid US-China tensions

Sep

22

2026

SiPearl delivers first homegrown server chips for Europe's exascale supercomputer

Anthropic, OpenAI expected to start buying memory directly in 2027

Vivo unveils X500 strategy to bolster premium phone push

Tmytek lists on Taiwan Innovation Board, pushes 5G/6G, satellite, defense

Changs Ascending eyes AI data center backup power, storage growth

Meta's AI agent Muse tops app charts, driving AMD's market cap past US$1 trillion

Hermes Testing sees growth opportunity in AI-driven chip demand as OTC debut expands reach

Taiwan's automakers gear up for year-end sales, as exports emerge as new growth engine

Unitree targets humanoid robots' next bottleneck with 22-DoF Dex5-S hand

Acer debuts first Googlebook with 360-degree hinge

Microsoft opens fourth India cloud region, casting Hyderabad as an AI hub for Asia and the Global South

Hanmi Semiconductor ships first FC Bonder 75 for 2.5D packaging

Alibaba speeds V900 rollout, targeting 20GW of data centers

NASA adds three SpaceX crew missions as Boeing's Starliner lags

Taiwan virtual asset law to help lower supply chain transaction costs

DeepSeek bets on Huawei chips for model training as Nvidia's China sales slip

DEEPX targets smart glasses with low-power NPU, eyes 6G AI RAN

Chinese automakers step up battery in-house push to reclaim cost control

Micron Taiwan union heads for strike vote as board, earnings calendar stall profit-sharing talks

Xiaomi open-sources MiMo-V2.6, publishes the bill for scaling reinforcement learning

Alibaba expands full-stack AI push as cloud data centers target 20 GW by 2032

BOE looks beyond displays with glass substrates for AI packaging

Samsung weighs 4nm expansion as HBM4 demand strains capacity

TSMC, ASE break ground on Taiwan's first advanced packaging cluster in Kaohsiung

Escalating risks, evolving safeguards: a chronological look at OpenAI's safety strategy

Chinese AMOLED material suppliers set for revenue gains as Gen 8 fabs boost localization

Googlebook opens preorders at US$899 for AI laptops

India's fifth chip plant goes live, capping Suchi Semicon's three-year buildout

Exclusive: China SiC capacity tightens, spilling orders over to Taiwanese foundries

MediaTek unveils Dimensity CX C10 Max for premium Googlebook devices

Meta's rumored Luna smart glasses may go camera-free for lighter design

Taiwan advances major science park expansion to support AI, semiconductor growth

Apple's reported AI server push could reshape its role in enterprise infrastructure

Brussels will put a public efficiency grade on Europe's data centers before it decides what to require of them

Huaqin challenges Quanta for Steam Deck ODM order

Taiwanese auto industry eyes 2027 for zero-tariff US cars

Microsoft Taiwan to double data centers as AI computing demand exceeds supply

ASML opens India operations but ties any scale-up to Tata's Dholera fab

Taiwan's Hai Kun submarine in final testing stages, eyes October delivery

China puts AI computing into orbit with first integrated satellite launch

Nscale seeks New York listing as AI infrastructure demand tests investor appetite

YMTC's capital arm enters FD-SOI — China's 12-inch SOI build-out gathers pace

China's memory race turns inward — CXMT, YMTC head toward patent showdown

Xpeng plans to license tech to more foreign automakers

MediaTek launches Dimensity CX brand for laptops, starting with a 3nm chip for Googlebook

Tesla speeds up Optimus mass production with China supply chain visits

Acer founder urges talent, trust, and innovation in AI era

Daeduck nears long-term supply deals as Doosan expands capacity amid tight T-glass supply

Analysis: Will AI glasses replace the iPhone? —Cook and Ternus see it differently

AirTAC sees pneumatic demand cycle extending through 2027 on China automation growth

Nvidia Rubin architecture drives high-end MLCC demand, solidifying Murata, SEMCO leadership

EZconn eyes 2027 high-core fiber ramp as shortages persist

AI inference demand surges as training slowdown talk fades

China carmakers lean on exports as domestic sales stall

DIGITIMES Insight: Full-color Micro LED set to exceed 30% of AR glasses shipments in 2027

US iPhone 18 Pro Max teardown reveals Qualcomm modem, suggesting prior supply-chain commitments

Loyalty Founder Enterprise sees AI server expansion lifting growth outlook

Trade, AI, rare earths, and Iran shape Xi-Trump 2.0 talks

Sep

21

2026

Microsoft CEO expected at Trump-Xi dinner amid rising AI debate

California orders AI safety audits and emergency shutdown planning

Taiwan firms keen on investing in US manufacturing

South Korea-US investment talks stall over commercial viability

Taiwan drone makers pursue dual-track growth on domestic defense orders, US market expansion

Kaohsiung's new industrial park targets advanced packaging suppliers for the post-Moore era

Samsung builds fab robot team, targets chip equipment maintenance

US auto groups press Trump to block Chinese automakers from the market

SDC president declares foldable leadership, urges Korea to defend OLED advantage

Lattice Mach-N2 transitions to 16nm FinFET, integrating post-quantum encryption to strengthen control security

China's smart glasses boom: AI evolution, market shakeout, macro trends

Qisda leverages ICT foundation to build one-stop AI healthcare platform

Europe's hydrogen trucks chase commercialization

Leading Interconnect Semiconductor starts Shenzhen advanced packaging substrate plant

Microsoft AI chief says regulation is not a bad thing

Rebellions chips process over 4 billion tokens a day for SK Telecom

Physical AI opens a new growth window for FD-SOI as China builds domestic supply chain

Tower Semiconductor to make Japan its largest optical chip base

Trump announces 'AI Force' as safety concerns and China rivalry mount

Apple, Xiaomi, Qualcomm each eye edge AI ecosystem gains

First Solar withdraws 337 case, shifts TOPCon patent fight

Z.ai's ZCode crisis exposes AI coding's enterprise trust gap

TSMC builds Kaohsiung hub to speed advanced packaging tests

Chinese image sensor maker GalaxyCore raises the stakes in high-end CIS

SK Hynix pushes deeper into logic for next-generation 3D DRAM

Tesla AI server order puts Pegatron back alongside Asus, 18 years after split

Musk's Memphis move puts xAI at the center of his empire

Samsung reportedly plans to double HBM4 output in 2027 as memory supply stays tight

EV battery demand is going global, yet material supply remains overwhelmingly Chinese

Wiwynn chair says AI hardware is being reshaped by power, cooling, interconnect demands

China sets first national perovskite solar testing standard

ByteDance's China AI chip push hits substrate shortage

Acer taps local health data to build sovereign healthcare AI

Intel reportedly in talks with AUO on advanced packaging

Shell oil shortage puts Volkswagen contract under review as Europe's aftermarket feels the strain

iPhone Duo takes the baton from 18 Pro to extend Apple's upgrade wave

Faraday Future says robotics, not EVs, must carry it to profitability

Largan makes seventh land, factory purchase of 2026 in co-packaged optics push

Acer founder says slowing AI development will be hard, amid call for AI slowdown

DB HiTek gains pricing power as 8-inch supply tightens

China monitor market splits as commercial demand holds up, premium displays gain ground

Foxconn takes EV ambitions deeper with Quantron commercial vehicle deal

CXMT closes in on DRAM leaders with G5 process breakthrough

IBM unit secures US$1 billion CHIPS Act award to expand quantum wafer manufacturing

Weekly news roundup: AI boom strains chips; Google's TPUs pay off, China eyes 3nm without EUV

Anthropic reportedly weighs a new model, outside safety auditors as its IPO clock runs down

Column: AI usage patterns may be shifting the case for self-hosted servers

AMAX expands liquid-cooled data center in push beyond hardware

US-Mexico trade talks put AI servers in focus as Taiwan ODMs seek common ground

DIGITIMES Insight: AI chip upgrades shift substrate supply bottleneck from upstream materials to equipment

Dassault Systèmes: AI-native transformation emerges as Taiwan's next industrial frontier

HEC Compucase AI server products drive 2026 revenue growth

ACES targets AI compute, power with cable ramp-up

Tyntek optical communications MPD ramps quarterly, 2027 capacity triples

Samsung reportedly cuts QD TV output 80% as Neo QLED phaseout looms

Ampoc AI PCB orders surge as it expands into CPO

AI safety debate heats up: Pegatron chairman urges risk controls, not an innovation halt

Podcast highlights: Apple could take the lead in foldable share

CHT completes 4th Taiwan-Matsu subsea cable, boosting offshore resilience

ACM Research's Shanghai unit leans on overseas installs, panel-level plating for its next leg of growth

India roundup: Semicon India 2026 puts commercial production and supplier investment in focus

Analysis: The race to superintelligence meets a demand for restraint — and the industry is split

Sep

20

2026

Charts: Two-thirds of Taiwan's chip equipment growth comes from testing AI chips

OpenAI, Microsoft filings intensify copyright fight over AI training

BYD plans four Europe factories as EU tariff pressure rises

AI capacity crunch drives up consumer tech costs, deepening China's deflation

Wiwynn brings cobots to L10 server assembly as AI rack testing drives factory redesign

Foxconn joins Quantron, Hongjing Drive in zero-emission commercial vehicle partnership

Chinese memory supply is disruptive to pricing, Acer's Jason Chen says, as shortages ease

Sep

19

2026

Amazon Leo clears Taiwan's NCC review, with commercial launch pointed at 2027

Power grids can't keep pace with AI data center boom in EU, US

Memory recovery, price hikes lift Niching IC substrate outlook, order visibility through 2H27

MediaTek, Vivo bring 30B MoE models on-device in next AI phone race

Interview: Advanced packaging shifts toward system-level co-design for AI

Thailand plans to swap EV subsidies for import taxes to defend its production base

Beyond Volkswagen, XPeng seeks to turn automotive R&D into a global tech enterprise

Charts: Taiwan's memory makers are outgrowing TSMC by a factor of eight

Ams OSRAM takes an automotive-qualified force sensor into robotic hands

CXL adds memory capacity, but HBM retains its bandwidth edge

Ventec invests NT$1.5 billion in Kunshan expansion for AI, HDI orders

Compal takes Compal Broadband Networks private to fold networking into its edge AI stack

Sep

18

2026

Solidigm weighs first US NAND fab, explores upstate New York

Analysis: China's 15th five-year plan spotlights diamond for AI chip thermal management

Winbond cements server NOR lead with Infineon deal

Corning to raise display glass substrate prices 15% from 4Q26

CXMT eyes NAND amid global shortage, taking aim at YMTC

Doosan commits KRW968 billion to CCL expansion as demand strains capacity

China's AI data center token costs hinge on access to advanced GPUs

China's memory push gains ground across LPDDR6, advanced NAND, with HBM still the test

CoreWeave launches US$3 billion bond sale amid growing revenue, debt

High-end GPUs may be slowing China's AI compute expansion

LGES, Samsung SDI reportedly booked out for two years as US restrictions and China slowdown reshape ESS market

Chip equipment makers face waits of up to 40 months for critical parts

Samsung deepens Euclyd ties as startup reportedly reaches test-chip stage

King Charles tests AI's safety consensus as Nvidia keeps its foot on the accelerator

CPO raises PCB downgrade concerns but switches stick with M8 CCL

iPhone 18 Pro sellouts across Taiwan as foldable Duo looms

ByteDance's second AI-agent phone drops forced automation for permission — yet app wall still up

Mobile SoC battle for 2026 centers on NPUs

Micron: AI memory crunch rewrites the market with long-term deals and custom designs

ByteDance builds strong supply chain force to master emerging hardware ecosystems beyond core demand

GlobalFoundries, Marvell expand SiGe capacity deal for AI optical connectivity

NCSIST showcases military tech at Taiwan Innotech Expo 2026

Foldable smartphone panel shipments fall 13% in 1H26 as market shifts to in-fold designs

Rumored Japan-US chip plant talks test whether two former chipmaking giants can rebuild at home

Resonac grows 300mm SiC crystal, marking a substrate milestone

Taiwan central bank keeps rates unchanged as inflation stays contained

Taiwan central bank warns market stability hinges on AI monetization

Global chipmakers answer India's pitch with equipment, materials, and R&D — not fabs

Tata Electronics put 16 MoUs on the record at Semicon India, join hands with Nexperia

Modi says India's chip mission has reached commercial production as Semicon 2.0 lifts the purse to US$13.5 billion

Housing slump and plant builds diverge as Tung Ho Steel sees AI demand support

China sees a second chance in VLEO as AI shifts the satellite race from chips to networks

Samsung taps Japan for 3.xD chiplet push as packaging race heats up

GaN is winning the AI power argument, not yet the cost battle

Huawei Connect 2026: Huawei scales supernodes into million-card AI systems

Samsung Display reportedly taps Sunic for KRW300 billion RGB OLEDoS push

Z.ai's next growth engine starts where compute scarcity ends

CATL looks beyond China's passenger-car squeeze as electric trucks become the next growth front

Micron's Taiwan investment passes US$47 billion as it rallies fab construction suppliers

Nvidia roadmap shifts to rack-scale AI with Rubin Ultra

Apple and MediaTek's latest SoCs address overkill performance by reserving space for agentic AI

FCS Group eyes North America layout, as plastics industry turns to material innovation

AI's next infrastructure squeeze is storage: Seagate sees demand accelerating

Taoyuan to sign high-end IC substrate MOU with Unimicron, Kinsus as Aerotropolis zone takes shape

Taiwan prepares 150-qubit quantum computer RFP, seeks 'win-win' partnerships with global suppliers

FIT hedges its AI optics bets with Corning EBO, TSMC co-packaging talks

Nan Ya accelerates AI materials shift with major capacity expansion

Taiwan's small businesses race into AI, raising the stakes for execution

DeepSeek engineer's warning suggests AI may reshape, not simply eliminate, technical work

Winbond's Infineon buyout puts GigaDevice under pressure

Sep

17

2026

AMD pivots to China developer ecosystems as Nvidia retreats

SK Hynix looks beyond HBM as inference workloads diversify

Asia's healthcare AI moves from trials to real-world deployment

Deloitte Taiwan seminar highlights system integration as Physical AI moves into industrial applications

Trumpf eyes glass as AI demand drives packaging innovation

Samsung bets on zHBM as 2.5D memory nears its limits

Topview sees supply-chain shifts supporting orders as AI investment reshapes its outlook

CXMT cashes in on the DRAM shortage — and takes aim at HBM

TSMC reconsiders 12-inch equipment donation as Taiwan overhauls scope of research partnership

Memory LTAs lock up 50-70% of capacity

The Trump-Jensen speakerphone diplomacy: how Nvidia turned political pressure into a seat at the table

VLEO emerges as next orbital frontier as China warns of critical 2026–2030 window

Humanoid robots could reshape MEMS demand as physical AI advances

Ardentec, Sigurd race into silicon photonics TIA testing as US client books capacity

Tier IV open-sources self-driving AI chip design to challenge Nvidia

Huawei Connect 2026: OceanStor M900 turns PB-scale KV cache into Huawei's next AI infrastructure layer

Wiwynn sees strong AI demand offsetting US data center pushback

Samsung Galaxy S27 series rumored to feature 4 models, reshaping flagship lineup with display and camera upgrades

China optical suppliers power smart glasses supply chain

Samsung expands SRAM, IP to speed chip development

AI's memory appetite is squeezing the electronics industry from the bottom up, Intel warns

Why Taiwan's tech needs better storytelling to win global capital

Foxconn Interconnect Technology targets the scaling challenge in AI optical interconnects

Taiwan readies ETS pilot as overseas expansion drives demand

Taiwan to pilot ETS by end-2026, experts urge three safeguards

Huawei Connect 2026: Ascend 960 puts industry-first NPO supernode at heart of Huawei's AI scale-up bet

20 of China's OSATs push into advanced packaging amid EUV curbs

iPhone 18 Pro preorders rise up to 20% in Taiwan as foldable Duo debuts

China's LCD trio flexes newfound pricing power as Taiwan panel makers retreat

FIT ramps up optical interconnect push as AI race shifts to connectivity

SK Hynix weighs US memory options as buyers lock in 2027 supply

Samsung reportedly starts Tesla chip trial production at Taylor fab

TOK completes KRW101 billion facility in South Korea to bolster semiconductor supply chain

AI risk split among tech leaders set to play out at Trump-Xi White House dinner

General-purpose home robots face sensing test

Circular economy tests material mastery and consumers' willingness to pay

South Korea's medical device city opens physical AI institute, aiming to train 1,400 workers in five years

Apple's AI ambitions are outgrowing the Mac — Nvidia may hold the key

Huawei sees AI agents driving 90% of token traffic by 2035

Foxconn links FII and FIT to tackle AI infrastructure beyond the chip

Dassault Systemes shifts to AI-native platforms, stakes its next phase on Taiwan

ByteDance's Anew Labs reportedly raises US$290M as AI drug discovery gains momentum

Taiwan machine tool makers target aerospace, semiconductor boom at major trade shows

Google reportedly weighs CoWoS backup for 2027 TPU as EMIB-T substrate yields lag

Exclusive: China's CAS institute charts DUV route to 3nm GAA without EUV

China's FAW may become GAC's second-largest shareholder, possibly restructuring the Toyota China model

Chip equipment, materials suppliers lead India investment pledges ahead of SEMICON India 2026

Onsemi puts power density at the center of its next-decade strategy

Fujifilm to invest US$83 million in semiconductor materials plant in India

Applied Materials announces 10-year investment plan ahead of SEMICON India

Lam Research plans US$1 billion India manufacturing expansion

Meta's next smart glasses reportedly drop the camera as privacy concerns mount

Musk hints at Tesla-SpaceX merger, but the companies are already converging underneath

SK Hynix reportedly eyes Intel Ohio plant for US memory production

Elon Musk urges rival testing to expose AI safety flaws

Column: China tightens rare earth controls, exposing hidden vulnerabilities in Taiwan's supply chain

Physical AI targets factory assembly pain points

Arcadyan expects third-quarter strength as Wi-Fi 7 upgrade cycle builds

BizLink's expansion strategy signals a wider shift toward localized, risk-aware global supply chains

Kinpo's push into higher-margin products, quantum control signals a wider industrial pivot

SK Hynix shifts supply chain planning for AI capex boom

South Korea's chip boom lifts 2027 corporate tax above KRW200 trillion

OpenAI details AI jailbreak as Nvidia's CEO calls for engineering controllability

Intel CEO warns of 2027 memory crunch and tighter CPU supply

Charts: Taiwan's chip packaging growth runs deeper than ASE

Samsung looks to outside suppliers as HBM boom shifts priorities

Apple's foldable phone puts thinness, weight in focus

DIGITIMES Insight: SiC substrate capacity expansion continued; 6-inch substrate prices expected to rebound in 2027

Huawei's 3D data center redesign targets the next AI compute density wall

TSMC's C.C. Wei says to solve problems, put customers first

Jensen Huang's Galaxy Z Fold8 spotlights Nvidia-Samsung ties

Charts: Memory chip designers carry Taiwan's IC design rebound

Huawei aims to become 'China's Nvidia,' rules out building satellites or spacecraft

Sep

16

2026

Analysis: Jensen Huang is in Trump's ear; what it means for Taiwan's chip supply chain

Infineon exits NOR Flash with US$1.12 billion sale to Winbond, reviving Spansion name

Samsung advances jump 70% amid shift to long-term memory deals

Taiwan, South Korea should stop comparing, says DIGITIMES chairman

India's Eastern state clears SiCSem's SiC unit in SEZ

DIGITIMES Insight: Google outlines AI compute expansion, speeds TPU cycle to 6 months

LEOTEK completes real-world test of AI traffic system at US smart city lab

Nvidia's Jensen Huang expected to attend Trump-Xi Summit as tech and trade take center stage

Why Wiwynn chose El Paso for its first US plant

Samsung and Qualcomm jointly developing organic bridges for 2.1D packaging

BizLink's CPO breakthrough hits the hard part: scaling

AI slowdown calls expose the financial strain of the frontier race

EV batteries cannot simply power humanoid robots, with energy density and costs posing key hurdles

Soaring memory costs threaten Netronix's e-reader growth, even as new display markets stay on track

SK Hynix union approves revised pay deal after 25-vote rejection

TSMC's overseas expansion faces talent management gap, says co-COO Y.J. Mii

SK Hynix, Intel in talks on US production to ease memory crunch

CPO ramp pushes silicon photonics testing upstream to catch defects early

Taiwan CCL makers ride Nvidia's M9 shift as AI servers move to 52-layer PCBs

Geckos sees copper paste as a lower-cost answer to shrinking glass via challenges

Samsung Exynos regains share as Galaxy phones test 2nm

Geopolitical shocks add business pressure as CBAM free carbon quotas extend to 2038

Meta globally rolls out Meta One subscription, tops 15 million sign-ups

Physical AI could reshape industrial computing as Ennoconn sees a long growth cycle

Samsung reportedly weighs Micron's newest memory for Galaxy S27

Apple reportedly accepts Samsung's 1Q27 memory hike, raising the 2027 smartphone cost floor

Micron unveils 512GB DDR5 RDIMM for next-gen servers

Samsung backs Dutch AI chip startup Euclyd in US$230M funding round

Samsung reportedly pushes conventional memory modules to partners in Vietnam and India as HBM crowds its back end

Glass substrates, TGV set to reshape 2027 advanced packaging race

Hanmi Semiconductor reportedly lands first back-end foothold at Terafab

Exclusive: Wiwynn expands US, Mexico plants, aiming to double capacity by 2027

Aleees locks in Tainan plant for 20-year North America order

Kepler bets HBM can scale without EUV — chip giants are buying in

Astera says customers are rethinking HBM needs for AI accelerators

AI efficiency fuels Jevons Paradox debate over HBM demand

Altera confidentially files for US IPO as AI chip demand fuels listing boom

MediaTek keeps Dimensity 9600 Pro on HBPoP as cost drives decisions

Sharp opens orders for Foxconn-built Nvidia AI servers, targeting JPY250 billion by fiscal 2030

Huawei reportedly scales back AITO role as Seres takes greater control

Apple, Intel links sharpen focus on Lens Technology's next glass growth markets

US-based Teradyne opens Bengaluru office to support India's semiconductor push

Advanced processes have no ready-made answers, says TSMC's COO

Interview: Forget transistors — speed is what's choking the chip supply chain, says Qnity exec

Novel 2D materials offer quantum breakthroughs as research ecosystem targets sub-1nm era

Commentary: China's US$4.5 trillion electronics target confronts the limits of manufacturing scale

Beyond 2nm: Dimensity 9600 Pro gives MediaTek a bigger role in mobile AI

Samsung reportedly taps TSMC for custom HBM base dies as new foundry dynamics emerge

FSC teams with South Korean maker on TGV equipment for glass substrates

A Taiwan machinery maker bets on AI to challenge Japan's grip on advanced capacitors

DIGITIMES Insight: Taiwan can power its AI chip boom — but not with green energy

South Korean NPU startups face validation hurdle in push for global sales

Apple's foldable phone faces durability test as suppliers eye crease risks

Star Shining launches IPO plan as renewable energy assets reach 676MW

ITRI showcases AI robots, drones to push commercialization in southern Taiwan

China's humanoid robot race, Part 2: Upstream profits gather around dexterous hands

AI server tracker: BMC, cable, case suppliers post August 2026 gains

DeepSeek to hire its first CFO as it aims for public listing, expands workforce

Apple exits Musk's AI lawsuit, but the fight over iPhone AI access is only getting bigger

As AI data centers hit a transmission wall, GlobalFoundries pushes into silicon photonics

DIGITIMES Insight: NVHBM is not a memory revolution; Nvidia seeks to platformize cHBM, dominate custom AI architectures

DIGITIMES Insight: Taiwan's small IC design firms face a weaker second half after rebound

AR glasses target 2 billion myopia users as China supply chain eyes doubling shipments

Chip revenue heads to US$2.4 trillion on price, not volume, Yole says

AI data centers give idle EV battery capacity a second life

DIGITIMES Insight: Google scales TPU systems to 1 million chips as power becomes the bottleneck

Amodei's AI slowdown call is unlikely to dent chip demand, industry sources say

iPhone Duo's identity shapes Apple's foldable strategy

DIGITIMES Insight: Intel may lack a price edge over TSMC on SK Hynix HBM base dies

Charts: Memory has held six of the ten fastest-growing spots in Taiwan's chip sector for seven straight months