TAIPEI, Taiwan - WeLink Solutions proudly introduces the RSQ11 NUC System, a next-generation industrial-grade computing platform built on Intel Twin Lake architecture. Designed for smart manufacturing, IoT, and edge AI applications, the RSQ11 combines high performance, efficiency, and rugged reliability within a compact form factor - now further reinforced by IEC 62443-4-1  certification for securing product development lifecycle process.Twin Lake Performance at the EdgePowered by Intel's latest Twin Lake processors, the RSQ11 delivers exceptional computing power with optimized energy efficiency - the ideal foundation for intelligent edge solutions.Intel N150 (4 cores, 6W TDP): Fanless efficiency for stable, low-power edge gateways.Intel N355 (8 cores, 15W TDP): Balanced performance for automation, machine vision, and AI inference.Combined with DDR5 memory, dual 2.5 GbE LAN, and modular M.2 expansion, the RSQ11 ensures seamless data flow, ultra-low latency, and flexible scalability - including integration with leading AI accelerator cards from Hailo or DeepX for enhanced edge intelligence.Cybersecurity Built into Every Stage - IEC 62443-4-1 CertifiedWeLink Solutions has achieved IEC 62443-4-1 certification, following a rigorous audit by TUV NORD Taiwan. This internationally recognized standard validates WeLink's secure product development lifecycle, ensuring that cybersecurity is embedded from initial design through final deployment.This certification reinforces WeLink's commitment to secure innovation across its portfolio - from modular computing platforms to ruggedized edge systems. For customers, it guarantees long-term security assurance, continuous vulnerability management, and  forward-looking readiness for upcoming regulations such as the EU Cyber Resilience Act (CRA)."As industries increasingly rely on connected intelligence, security must be built into the hardware foundation," said a company representative. "With IEC 62443-4-1 certification, our RSQ series combines industrial reliability with verified cybersecurity, empowering global partners to deploy smarter, safer edge solutions."Engineered for Industrial IntelligenceThe RSQ11 embodies WeLink's vision of compact power with infinite possibilities. From factory automation and intelligent transportation to AI-driven edge analytics, the RSQ11 adapts seamlessly to diverse industrial applications - delivering the reliability, scalability, and security essential for Industry 4.0 and beyond.

NEXCOM International, a global leader in rugged edge computing platforms, and Stereolabs, a pioneer in AI vision and 3D perception,  announced a long-term collaboration to deliver cutting-edge AI vision solutions for B2B organizations across mobility, robotics, and industrial automation sectors. The integration of Stereolabs' ZED X series cameras with NEXCOM's ATC series Edge AI computers makes deploying intelligent visual systems faster, more reliable, and more scalable than ever.Stereolabs' latest ZED SDK 5.1, powered by TERRA AI, offers breakthrough perception capabilities, optimizing spatial awareness and system efficiency. These enhancements make the ZED X series ideal for advanced AI vision applications where precision and responsiveness are mission-critical:5x faster depth sensing and up to 300% processing load reduction on NVIDIA Jetson platformsSharper depth accuracy in challenging conditions such as low light, fog, or reflective surfacesMagellan, Stereolabs' new localization technology, delivering centimeter-level precision both indoors and outdoors NEXCOM's ATC series of Edge AI computers are built for extreme environments where ruggedization and reliability are essential. This, along with NEXCOM's expertise in designing tailored solutions for physical AI deployments, makes for a powerful integration with Stereolabs' solutions for some of the most complex needs of industrial organizations. Key features of NEXCOM's ATC series include:IP67-rated design: Resistant to dust, water, vibration, and extreme temperatures,AI acceleration: Powered by NVIDIA Jetson modules for real-time edge inference,Industry compliance: Certified with E13 and EN50155 standards for transportation and industrial applications,Vehicle integration: Built-in IGN control and smart power management,Multi-camera support: Capable of processing high-speed, low-latency video streams.Accelerating AI vision across key B2B industriesNEXCOM's and Stereolabs' collaboration empowers critical use cases for B2B organizations across industrial and mobility sectors seeking to introduce AI Vision to drive efficiency and safety:Public transit: Mobile surveillance, infotainment systems, and passenger analytics,Robotics: industrial robots, robotic arms, AMR, Quadruped, and humanoid visual sensors,Public safety: static/mobile ANPR, enforcement monitoring, civil/emergency services,Industrial automation: predictive maintenance, defect detection, blind-spot monitoring,Material handling: enhanced monitoring for ports, warehouses, and fleet operations,Earth moving & mining: rugged AI deployments in construction, agriculture, and mining environmentsBy combining NEXCOM's ruggedized hardware with Stereolabs' advanced AI vision technology, businesses can accelerate AI implementation in complex real-world environments. This collaboration reduces technical barriers and enables scalable deployment of AI vision systems tailored for industrial and commercial success."This collaboration comes at the right time," said Jay Liu, Vice President, NEXCOM. "By combining NEXCOM's ATC edge computing platform with Stereolabs' ZED AI vision stack, we're enabling robust perception solutions that transition seamlessly from prototype to large-scale deployment,""With ZED SDK 5.1 and TERRA AI, we're pushing the boundaries of physical perception: enabling cameras that not only see better in complex environments, but also understand the world with unprecedented intelligence, paving the way for new classes of smarter systems," said Cecile Schmollgruber, CEO of Stereolabs.The integration of Stereolabs' ZED X series cameras with NEXCOM's ATC series Edge AI computers makes deploying intelligent visual systems faster, more reliable, and more scalable than ever. Credit: NEXCOM

From TSMC to SK hynix, every Q3 2025 earnings call delivered the same sobering message, the AI build-out is being throttled by three physical choke points that no amount of 2025 capex can fix fast enough. Leading-edge foundry, HBM memory, and advanced packaging are all sold out, not just for next quarter, but for the next three to five years. Here’s exactly where the wall is.High-Bandwidth Memory (HBM): The New KingmakerHBM has become the single most important component in the AI hardware stack and the scarcest. It’s no longer something you buy. It is something you reserve 18–24 months in advance and hope your allocation sticks.Reading the Q3 reports, Industry leaders have been blunt:SK hynix CFO Kim Jae-joon: "We have already sold out our entire 2026 HBM supply… supply expected to remain tight compared to demand into 2027."Micron CEO Sanjay Mehrotra: "Our HBM capacity for calendar 2025 and 2026 is fully booked."Samsung Memory: "Customers' demand for next year will exceed our supply, even considering our investment and capacity expansion plan."The consequences are cascading across the industry.The ripple effects are hitting the whole industry. Next-gen platforms like Blackwell Ultra, Rubin, AMD MI400, and everything coming after are now stuck behind memory limits. GPU and AI server lead times have stretched to 12–18 months, BOM costs are climbing, and procurement teams are buried in broker spreadsheets.Even worse, HBM expansion is eating into conventional DRAM. DDR5, LPDDR5, and even older DRAM lines are getting squeezed, setting up surprise shortages in laptops, smartphones, and cars through 2026.HBM has officially become the choke point for the entire AI sector.CoWoS Advanced Packaging: The Real Limit on GPU SupplyYou can have perfect 3 nm chiplets and pristine HBM stacks but without a CoWoS slot, you're holding an extremely expensive paperweight.TSMC’s CoWoS-L/S/R processes are what bind chiplets and HBM cubes using massive interposers and through-silicon vias. That assembly step, not silicon, is now the single most critical governor on AI GPU output.TSMC CEO C.C. Wei: "Our CoWoS capacity is very tight and remains sold out through 2025 and into 2026."NVIDIA CEO Jenson Huang: "CoWoS assembly capacity is oversubscribed through at least mid-2026," directly delaying volume Blackwell Ultra ramps.TSMC is expanding CoWoS capacity by roughly 60% in 2025 and 50% in 2026, but every new cleanroom module is spoken for long before it opens. AMD, Broadcom, Google, Amazon, Meta, everyone is fighting over the same finite packaging slots.Leading-Edge Foundry (3 nm/2 nm): Locked Up Until Late 2020sIf you didn't secure N3E or N2 production capacity back in 2023, you're effectively locked out.TSMC has been explicit:TSMC CEO C.C. Wei: "Frontend and backend capacity for leading-edge nodes is extremely tight… Customers' demand for the next year will exceed our supply, even considering our investment and capacity expansion plan."Apple consumed the bulk of N3 capacity for 2024–2025. What remained was divided among NVIDIA, AMD, Broadcom, and a handful of hyperscalers. TSMC's upcoming 2 nm fabs in Arizona and Kaohsiung won't reach meaningful output until late 2026 or early 2027, and much of that is already pre-allocated.Samsung's GAA roadmap is still trailing on yield and power efficiency, leaving nearly the entire industry dependent on a single geographic region.For any AI startup or any new chip program that didn't book capacity during the 2023–2024 scramble, the earliest possible tape-out now lands around 2028–2029.The Zero-Slack Era: 2026–2027 Demand Already 30–50% Above Planned SupplyThe most chilling part? Every CEO said the same thing, almost word-for-word:TSMC: "We are working very hard to narrow the gap between demand and supply."SK hynix, Micron, Samsung, Intel, NVIDIA-all echoed that even after $200 billion+ of collective capex, supply will still fall 20–50% short of demand in 2026 and 2027.If you are tired of hearing "fully booked through 2027" and watching your roadmaps slip quarter after quarter, talk to Fusion Worldwide. We specializes in AI ICs procurement, providing real-time visibility into ICs availability across all major manufacturers. Our E-commerce platform delivers instant availability checking, automated quote management, and rapid fulfillment capabilities that help procurement teams secure critical storage components even in constrained markets.Don’t wait for the next earnings call to tell you the gap got worse. Get Out In Front, Move now.(Article Sponsored by Alan Chew, Global Director of Strategic Accounts, Fusion Worldwide, Singapore)

The manufacturing industry is facing major changes with the rapid development of artificial intelligence (AI) technology, which has made computing power and AI application services the "new oil" that fuels the competitiveness of enterprises. However, simply stacking hardware is not enough to run AI models, which are highly dependent on a stable and secure computing environment with low latency. The only way to ensure enterprise-level power, cooling, network bandwidth, and cybersecurity for the deployment of AI applications at scale is to set up the AI model in a professional Internet data center (IDC).Founded in 2009, Global Instrument Technology (GIT) initially provided instrument rental and automation solutions. However, its business expanded along with the upgrading of Taiwan's manufacturing industry, as it focused on optimizing networking, semiconductors, automotive electronics, and EMS production lines. It even expanded into surface defect detection for popular products, such as e-readers and Apple Watches. The company subsequently expanded to smart manufacturing solutions, such as the Industrial Internet of Things (IIoT) and early warning of anomalies, under Industry 4.0, expanding from single-point improvement to system-level optimization.GIT saw that the clearest trend in the manufacturing industry in recent years has been the rapid adoption of AI by factories. Its application scenarios include image inspection and IIoT. However, in addition to software capabilities, the support of a stable and high performance computing environment and network architecture are also needed to actually run AI models in production lines.To help customers in the manufacturing industry adopt AI more quickly, GIT partnered with Chunghwa Telecom to provide enterprises with an "AI application verification platform" and integration services in a secure and high performance professional IDC environment. This architecture allows enterprises to verify AI image inspection models and analyze the quality of AI models without increasing the burden of hardware, thus shortening the time from proof of concept to implementation.Professional IDC has become the foundation for stably running AI models with cooling, power, network, and cybersecurity all in placeTsai noted GIT chose a professional IDC to deliver stable AI services and trusted commitment. Credit:GITThe biggest difference between AI servers and regular servers is their power consumption, heat generation, and bandwidth requirements. "It would be very hard to let corporate customers feel at ease if we kept our servers at the company and managed them ourselves." Tsai Pei-Ying, IT Manager at the Head Office of GIT, got straight to the point: AI requires a trustworthy environment to ensure stable, high-performance, and secure processing.Therefore, GIT set the goal to relocate into a professional IDC, and evaluated five key criteria: Is the power supply stable? Is the temperature under control? Is the bandwidth adequate and is the latency acceptable? Is cybersecurity good enough? Is the quality of professional services reliable? GIT evaluated numerous service providers, focusing on their ability to operate at full capacity for extended periods of time without interruption, as well as their scalability, so that new businesses would not be slowed down by infrastructure limitations once launched."From our perspective, IDC is not just a place to house servers, it is the foundation that enables AI applications to run stably," said Tsai Pei-Ying. GIT delivers more than just AI, it delivers a comprehensive system integration service that encompasses equipment, data transmission, security, and maintenance, offering a total solution for AI implementation.From cold aisles to high bandwidth, the guardian safeguarding the stability of AI serversIn the end, GIT chose Chunghwa Telecom's IDC. "Chunghwa Telecom is able to fully meet all five of our requirements!" Tsai Pei-Ying pointed out that the instantaneous power consumption of a single AI server can reach up to 10 kW, so it has extremely high requirements on the stability of power supply.Chunghwa Telecom's IDC has a complete power and temperature control plan in place to ensure that servers can operate safely for extended periods of time. Using environmental control as an example, AI servers need to operate between 10 and 35 degrees Celsius, so Chunghwa Telecom specially designed "cold aisles" for faster heat dissipation and cooling to maintain optimal conditions for equipment.AI applications impose equally astonishing demands not only on power and cooling, but also on bandwidth. Using AI image inspection as an example, the size of a high-resolution image can reach several hundred megabytes, so high network latency can greatly lower the efficiency of training and inference. Chunghwa Telecom's IDC provides high bandwidth capable of instantly meeting massive data transmission demands, ensuring that customer services are not interrupted.In terms of cybersecurity, Chunghwa Telecom has worked closely with GIT to tailor cybersecurity solutions. From hardware firewalls to "cybersecurity fleet" solutions, the comprehensive protection mechanisms not only allow GIT to provide AI services without any concerns, but also lay the foundation for future expansion."Chunghwa Telecom offers highly competitive one-stop services that have saved us great effort in resource integration." Manager Tsai Pei-Ying was straightforward when explaining the main reason why the company made the decision: They have never had to worry about the quality of Chunghwa Telecom's operation and maintenance. The value of providing one-stop services has been proven again and again in actual operations: All requests, no matter the scale, can be handled at a single window.The top-tier quality of the IDC's operation and maintenance has made GIT more confident in its future developmentThe services of Chunghwa Telecom's IDC have gained the trust and confidence of GIT ever since it became a tenant. Stability is the top priority. In addition, the density of Chunghwa Telecom's resources across multiple locations throughout Taiwan and its backbone network allows service nodes to be located closer to demand, achieving lower latency and greater stability.GIT is currently focused on assisting the manufacturing industry in developing scenarios for implementing AI, such as image defect detection, automated quality monitoring, and digital twin systems. With the support of stable computing capacity provided by the IDC, these AI applications will be able to move on from proof of concept to become a part of routine operations, gradually becoming the new normal for smart manufacturing.Trust is key: Let a professional IDC handle strategic infrastructureWang Sin-Siang, Vice General Manager of GIT (right), and Tsai Pei-Ying, IT Manager of GIT (left).Credit:GITFrom the perspective of GIT, the AI application verification platform is not a short-term project. It is a long-term strategic direction to be simultaneously carried out by the manufacturing industry. Stable, flexible, and secure infrastructure is the key to letting enterprises experiment with AI and not be priced out by the initial cost."Trust" is the key that makes all of this possible. As mentioned by Manager Tsai Pei-Ying, moving into a professional IDC is a necessary condition. Letting a team that understands data centers, networks, and operation and maintenance provide capital-intensive infrastructure is the only way AI will have a chance to move forward from technical projects to a stable part of routine operations. Chunghwa Telecom's one-stop, single window is a catalyst for reducing friction and accelerating development. Stability, predictability, and scalability are what give customers peace of mind.With the strong support of Chunghwa Telecom's IDC, GIT is driving the rapid adoption of AI in the manufacturing industry. When AI is no longer an experiment and is fully embedded into production processes, Taiwan's AI-enabled manufacturing industry will be able to move towards a replicable and sustainable future.Learn more about Chunghwa Telecom's IDC solutions.

As digital technology becomes more prevalent and customer expectations rise, digital menu boards have emerged as crucial tools for chain restaurants looking to boost branding and operational efficiency. Nonetheless, several businesses continue to encounter difficulties during the deployment process, such as asynchronous content updates, frequent equipment failures, and insufficient remote maintenance. This limits headquarters' ability to update menu information nationwide, while fan failures and extensive maintenance of standard display systems raise expenses.Smart solutions for smoother operationsA notable Taiwanese restaurant chain has implemented ASUS IoT's advanced Internet of Retail Things (IoRT) solutions to tackle these operational issues. ASUS IoT Cloud Console (AICC), along with its PE1000S industrial computer, facilitates a dependable, efficient, and intelligent operational transformation throughout the chain's multiple locations in Taiwan.Given that digital technology has become the foundation for modern chain restaurants, Clark Chang, Sales Manager at ASUS, underscored the importance of maintaining high operational stability, maintenance efficiency, and management effectiveness. ASUS IoT's solutions, which focused on the PE1000S industrial computer, demonstrated exceptional performance in terms of system stability, maintenance simplicity, and hardware-software integration, earning the endorsement of the restaurant chain client and becoming standard equipment in the customer's stores.Compact, fanless design built for reliabilityThe ASUS IoT PE1000S industrial computer, tailored for the food and beverage sector, features a compact, fanless design. It is tiny and may be mounted directly behind a digital display, maximizing space while maintaining the store's aesthetic consistency. The fanless heat-dissipation design is an essential feature, effectively averting disruptions caused by dust accumulation or fan failure in traditional equipment. It ensures reliable operation even under harsh conditions, such as high temperatures and oil vapor.Additionally, ASUS offers a three-year warranty, one year longer than comparable products-helping reduce maintenance costs and extend equipment lifespan. The solution is built on a Windows-based architecture, enabling system integrators to accelerate implementation and shorten deployment time, thereby advancing store digitalization. This architecture also ensures broad compatibility and seamless connectivity.Intelligent maintenance through centralized controlBy integrating its in-house developed AICC management platform and leveraging a robust hardware foundation, ASUS IoT is able to improve e-menu systems, thereby incorporating intelligent maintenance features. The integration of the PE1000S and AICC enables chain restaurant operators to guarantee the sustained operation of front-end equipment while simultaneously monitoring the state of each location in real time.Chang said that AICC consistently monitors equipment performance and automatically issues notifications if any irregularities occur. IT specialists can remotely access systems to diagnose, reboot, or modify parameters, thereby substantially reducing the need for on-site maintenance and alleviating the workload on personnel. A consolidated cloud backend enables headquarters to centrally oversee equipment throughout Taiwan, decreasing the average maintenance response time from 24 hours to under two hours. The comprehensive solution emphasizes stability, a lightweight construction, and intelligent maintenance, allowing e-menu systems to function dependably for prolonged durations in high-temperature, high-frequency settings.Proven results and a path toward AI-driven retailThe restaurant chain client has maintained consistent operations across thousands of stores in Taiwan for more than two years since the system's implementation. The incidence of equipment failure has diminished by more than 80% relative to the pre-implementation phase. IT staff can resolve over 90% of software anomalies or system restart requests in real time, decreasing the average repair time from eight hours to 30 minutes, thanks to the centralized monitoring and remote maintenance capabilities of the AICC platform.This greatly improves operating stability and maintenance efficacy. The headquarters may centrally oversee menu material throughout Taiwan, guaranteeing uniform brand messaging, while empowering store managers to modify individual store menus in real time through a mobile application, thereby adeptly accommodating local promotions or festive occasions. Customer feedback indicates that following enhancements in system stability, promotional activities resulted in an average sales increase of approximately 15%, evidencing a definitive return on investment.The digital dining technology and its applications have attained a substantial level of maturity, resulting in a saturated market of competing products, according to Chang. The customer ultimately selected the ASUS group, and ASUS IoT in particular, thanks to the quality of its products, with information security and local trust serving as critical factors in their decision-making process.ASUS, a Taiwanese company, ensures the security and transparency of its entire supply chain by providing dependable hardware, as well as extensive software development and technical support. Moreover, the ASUS IoT technical team is capable of promptly addressing customer needs by providing localized maintenance and support services, thereby bolstering the confidence of businesses in their digital transformation initiatives.From devices to AI-driven insightsASUS IoT is advancing retail applications from "device implementation" to a new phase of "AI-driven decision-making," according to Chang. ASUS IoT intends to provide kitchen display systems (KDS), self-checkout (SCO) systems, and AI-driven customer behavior analysis modules to aid businesses in enhancing operations and acquiring insights into consumer behavior. The restaurant chain client has utilized the data analysis capabilities of the ASUS AICC platform to amalgamate interactive data from e-menus with POS sales data. This has been executed to inform operational strategy and product development.ASUS IoT will also collaborate with system integrators and startup partners to establish a 'co-growth ecosystem' that enables the implementation of smart retail solutions through a standardized interface and open architecture. This ecosystem will evolve from ensuring hardware stability to enabling intelligent operations, serving as a catalyst for the digital transformation of Taiwan's food and beverage retail industry.Credit: ASUS

As energy consumption in AI servers and data centers rapidly increases, High Voltage Direct Current (HVDC) has emerged as a key direction for next-generation power system. Traditional AC/DC multi-stage architectures suffer significant conversion losses, limiting overall efficiency to around 85%, prompting the industry to accelerate its transition toward 800V (or ±400V) HVDC systems.In response, GaNrich Semiconductor Corporation (GaNrich) announced it will launch its 1200V High-Voltage GaN (HV GaN) product series by the end of 2025. Built on GaNrich's proprietary GaN on Sapphire platform, the series features low Rds(on), high breakdown voltage, and outstanding efficiency. It is designed for data-center power management, AI server power modules, and emerging HVDC systems.As the first global supplier offering pin-to-pin GaN replacement solutions, GaNrich enables its 1200V GaN FETs to directly replace SiC devices. Under high-frequency HVDC input operation, switching loss is reduced by 30%, gate-drive loss by 90%, and auxiliary power size by 50%. On the output side, GaNrich's 100V GaN offers more than 50% lower on-resistance compared with equivalent Si MOSFETs, offering a clear efficiency advantage.In the medium-voltage sector, GaNrich started mass production in Q3 of its 100–200V, 1–10 mΩ MV GaN product line-up, available in multiple double-sided-cooling RQFN and DFN packages. The newly launched RQFN 5×6 device achieves leading TCR (temperature coefficient resistance) performance, delivering superior high-temperature current capability versus competing GaN and SGT MOSFET devices. Applications include HVDC power supplies, power bricks, drones, industrial automation, and robotics.According to NVIDIA's published 800V HVDC white paper, GaN/SiC device typically follow three topologies combinations in HVDC system: 1200V+100/40V, 650V + 100/40V, and 200/150V+40V. GaNrich is currently the world's only supplier capable of delivering all device combinations through a unified product portfolio. Building on extensive expertise in GaN chip design, packaging, and system module integration, GaNrich provides a comprehensive voltage range from medium to high voltage, offering high-efficiency and miniaturized power-conversion solutions that accelerate the real-world adoption of GaN in HVDC and power system applications.

The semiconductor sector demands stringent security and cybersecurity standards; any lapse may compromise brand reputation and operational integrity. Conventional surveillance still encounters challenges, such as the inability to analyze extensive camera footage in real time, reliance on manual risk inspections, and the tendency for most incidents to be investigated retrospectively, despite the establishment of stringent management systems.From passive monitoring to proactive protectionASUS IoT's AISEHS intelligent image-detection platform employs AI technology to convert image data into actionable insights, assisting prominent Taiwanese semiconductor manufacturers in transitioning from passive security management to proactive prevention, thereby initiating a new era of intelligent security in the manufacturing sector.Delfina Shih, Product Manager of ASUS AI Solution Business Unit, stated that semiconductor facility safety management is primarily passive, with current operations dependent on post-event verification procedures. The widespread deployment of CCTV cameras at every site usually impedes the attainment of comprehensive and real-time surveillance, resulting in human fatigue-related errors. The absence of data-driven management tools makes it impossible for employees to undertake trend analysis or optimize SOPs.Secure, compliant, and seamlessly integratedThe AISEHS platform adheres to the rigorous standards and operating requirements of the semiconductor sector. AISEHS employs a multi-tiered access control system to ensure that each department can access only relevant data, hence preventing interdepartmental information breaches. Deployment architecture includes pure cloud, hybrid cloud, and pure on-premises to fulfill the security compliance requirements of various companies. Furthermore, automated deployment procedures and quick model iteration approaches ensure that system updates do not disrupt on-site operations. The platform simplifies integration with existing client's video-management system (VMS), incident management, and internal communication systems This significantly improves management efficiency by enabling the detection, reporting, and resolution of security issues within a unified environment.AI-driven detection and instant responseThe AISEHS platform provides critical detection capabilities, such as the identification of personal protective equipment (PPE), which speeds up the assessment of an employee's proper use of safety equipment. Virtual fencing detection effectively prevents unauthorized entry into risky areas, whereas hazardous behavior detection monitors high-risk operations, such as maintenance or climbing, and automatically checks compliance with safety procedures. The system also includes a real-time notification mechanism that immediately alerts relevant personnel when abnormalities are detected and provides video clips to help quickly locate and address issues. In order to facilitate management decision-making, the data dashboard presents contractor performance assessments, risk locations, and event patterns. In addition, the platform enables clients to integrate their own models to enhance applications and fully capitalize on their current AI investments, thereby facilitating the incorporation of third-party AI models.AISEHS facilitates global deployment by leveraging four important technologies to address the transnational operating needs of semiconductor businesses. Firstly, the RTSP streaming protocol facilitates the quick integration of surveillance devices from many manufacturers,  achieving real-time image acquisition and AI identification. Secondly, multi-tenant management makes it easier to construct autonomous tenants based on factory zones or companies, as it ensures unique data permissions and reduces interference. Thirdly, the AI task-scheduling method allows for the definition of detection intervals, with models activated only when necessary to maximize computational resources. Lastly, custom detection logic can run multiple AI models simultaneously, such as personnel counting and helmet detection, which improves implementation efficiency and lowers customization costs. Empowered by a software-defined surveillance approach,  firms will be able to balance centralized administration with localized flexibility in global operations, resulting in a consistent level of safety regulation.Delfina stated that a key advantage of AISEHS is the thorough use of existing infrastructure. The platform may be integrated easily into existing CCTV systems and network infrastructures, eliminating the need for rewiring or the purchase of new equipment. The installation process does not disrupt ongoing surveillance operations. Compared with traditional system overhauls that may take months, AISEHS requires only a security assessment of the existing platform, thereby shortening the deployment time to 2-3 weeks and enabling the transformation of conventional surveillance systems into AI-enhanced smart security frameworks.Proven performance and measurable gainsA semiconductor leader has reported positive outcomes one year after deploying the ASUS AISEHS platform. On-site worker self-discipline has increased significantly, resulting in an 82% reduction in risk occurrences thanks to AI-powered real-time monitoring and event retrospective capabilities. The AI electronic fencing provides automatic nighttime surveillance, resulting in an annual labor cost savings of about US$400,000 per sentry. Scheduling approaches and computational resource monitoring enabled more accurate allocation of GPU/CPU computing capability, resulting in a 83%  reduction in resource consumption. Operational efficiency has increased dramatically, with event processing time reduced from 30-60 minutes of cross-system manual confirmation to less than five minutes for confirmation and response. The AI model's accuracy exceeds 90%, while the actual operating error rate is less than 1%.Expanding toward intelligent, industry-wide protectionASUS IoT is making a concerted effort to enhance the functionality and scope of its AISEHS platform in order to align with its future objectives. New modules, including behavioral-anomaly detection and SOP execution analysis, will be incorporated in the future, transforming it from a security management system to a comprehensive intelligent platform for operational security and production stability. The platform will include an MLOps module to comply with cybersecurity and data sovereignty regulations. This module will enable customers to complete the entire lifecycle of data annotation and model training on-site, thereby accomplishing the objective of data remaining at the factory, and models autonomously upgrading.ASUS IoT has also initiated discussions with industries such as energy, metal refining, and petrochemicals to assess the potential for extended use of the technology in field applications.  Delfina noted that ASUS IoT intends to build AI as a basic technology for operational protection and risk prevention, strengthening security management mechanisms with a smart and efficient system.Credit: ASUS

HOLTEK Semiconductor, a leading professional microcontroller IC design company, will host its 2025 Online New Product Presentation on December 4th. This year's event will center on the theme of "Empowering Intelligence for Sustainable Development," integrating smart control and edge computing to build a comprehensive smart living application ecosystem. The thematic application areas cover: smart living and IoT, green energy, Edge AI, Arm Cortex MCUs and peripheral ICs, HT32 development tools, and other cutting-edge technologies and products.HOLTEK Semiconductor provides customers with highly integrated, competitive products and solutions that offer enhanced user experiences, enabling rapid design implementation and mass production. We continue to deliver leading-edge advantages to our customers and partners. We warmly invite both existing and new clients to attend and provide valuable feedback.Register now by visiting the link or scanning the QR code.

Global computing power is growing aggressively and pushing high-density chip power consumption. As this power density increases, traditional air cooling is reaching its physical limits, and once-fringe liquid cooling technology, boasting thermal efficiency hundreds of times greater than air cooling, is rapidly becoming core infrastructure.Driven by global sustainability targets and the need for high-performance, energy-efficient infrastructures, new large data centers must achieve their targeted PUE values, accelerating the industry towards large-scale liquid cooling. However, reliability issues stemming from insufficient mechanical tolerances at the connection points of liquid cooling systems are becoming a critical bottleneck for energy efficiency upgrades and stable operation. Southco recognizes the severity of this challenge and is committed to providing breakthrough solutions.Minor Deviations, Major CostsDuring the large-scale deployment of liquid cooling technology, the reliability of connection interfaces is vital. According to key data from the Open Compute Project (OCP) "Rack-Mounted Manifold Requirements and Verification Guidelines," a mere 1mm increase in mechanical deviation at liquid cooling interfaces can significantly raise system flow resistance by 15%, leading to a 7% increase in pump energy consumption!This is no trivial amount; in a hyperscale data center with thousands of interfaces, it translates to millions of kilowatt-hours of additional energy consumption and substantial operational costs each year. More concerning is that traditional rigid connection solutions typically offer only ±0.5mm of static tolerance, which proves inadequate in complex real-world environments like these:1. Accumulation of Multi-Dimensional Installation Deviations: In mixed deployment scenarios of widely used EIA-310-D standard racks and advanced ORV3 open architectures, rack installation tolerances can accumulate up to ±3.2mm, far exceeding the limits of traditional solutions.2. Dynamic Vibration Impacts: In ISTA 3-E vibration tests simulating real transportation and operating environments, interface displacement often exceeds 2.8mm, posing significant risks of leaks or connection failures.3. Material Thermal Expansion Effects: Under a typical temperature change of 55°C, copper alloy manifolds can expand approximately 1.2mm per meter, continuously challenging fixed interfaces.These dynamic, multi-dimensional deviations underline the urgent need for an intelligent, reliable sealing connection solution to ensure the long-term, efficient, and safe operation of liquid cooling systems.Blind Mate Quick Disconnect: A Connection for a Dynamic WorldAs a century-old expert in precision engineering, Southco confronts this challenge head-on with the launch of the revolutionary new "Blind Mate Floating Mechanism" liquid cooling connection solution. This innovation is not just a new product; it is a systematic response to profound insight into industry pain points.Current Status and Trends of Blind Mate Floating TechnologyLiquid cooling technology is rapidly gaining traction in high-performance computing (HPC), AI training clusters, and hyperscale data centers. Blind mate technology allows devices to connect without precise visual alignment, making it a core interface solution for rapid deployment and efficient maintenance in liquid cooling systems (especially cold plate systems). The development trends are clear:1. Higher Tolerance Capacity: Adapting to more complex rack environments and dynamic changes is essential.2. Increased Reliability: Zero leakage, long lifespan, and resistance to extreme conditions are basic requirements.3. Intelligent Integration: Integrating sensors for flow, temperature, pressure, etc., for real-time monitoring and predictive maintenance is a future direction.4. Standardization and Compatibility: Supporting OCP ORV3 and other open standards for seamless integration across platforms and manufacturers.Standard ISO 11926-1 threaded interface design, compatible with OCP UQD/UQDB connectors, and custom designs are available.5. Lightweight and Compact Design: Meeting the demands of higher density deployments.Southco's Blind Mate Floating Mechanism exemplifies innovative design centered around these core trends.Advantages Over Traditional SolutionsCompared to traditional fixed or simple floating heat transfer connection solutions, Southco's "Blind Mate Floating Mechanism" offers a qualitative leap with advantages evident across multiple dimensions.1. Three-Dimensional Dynamic Tolerance Control: Southco’s innovative design features a groundbreaking three-dimensional dynamic compensation mechanism: ±4mm of floating tolerance in the radial direction (2° tilt compensation) and 6mm of displacement absorption capacity in the axial direction. This far exceeds common static tolerances in the industry, effectively absorbing and adapting to all previously mentioned installation tolerances, vibration displacements, and thermal expansion deformations.2. Self-Centering Mechanism: When the liquid-cooled blind-plug connector is unplugged, the floating structure automatically resets to the center position, ensuring sufficient floating space for plugging and unplugging operations, fully meeting the strict tolerance requirements of OCP and ORV3 standards.3. Outstanding Sealing Performance for Long-Term Operation: Products endure rigorous ASME B31.3 standard 300psig burst pressure tests, ensuring over 10 years of service life, providing long-term stability for data centers, an achievement traditional solutions cannot match.4. Efficient Maintenance and Significant Cost Reduction: Featuring the Universal Quick Disconnect Blind (UQDB) interface, the design enables genuine "blind operations," allowing server maintenance without precise alignment or specialized tools. Quick disconnect capabilities make server replacement or upgrades as convenient as "hot plugging," reducing downtime and related losses by over 90%.Blind Mate Floating Mechanism. Credit: SouthcoThe Necessity of Blind Mate Floating MechanismIn AI computing clusters and next-generation data centers, adopting advanced connection solutions like Southco's "Blind Mate Floating Mechanism" is no longer optional, but essential.1. Key to Overcoming Cooling Bottlenecks: High power density is an inevitable trend; traditional cooling and rigid connections can no longer meet the demand. The Blind Mate Floating Mechanism is foundational for unleashing the full potential of liquid cooling and ensuring efficient, stable operation of cooling systems.2. Cornerstone of Business Continuity: The costs of data center downtime are immense. The rapid, reliable thermal maintenance supported by the Blind Mate Floating Mechanism is vital for ensuring uninterrupted operation of critical business activities 24/7.3. Core to Achieving Green and Low-Carbon Goals: Minor deviations in connectors leading to increased flow resistance can significantly elevate pump energy consumption. Its high-tolerance, low-flow resistance design directly contributes to lowering data center PUE values, making it an important element in energy conservation and emissions reduction goals.4. Flexibility for Future Expansion and Upgrading: Modular and standardized design enables data centers to expand capacity and upgrade equipment more flexibly, easily accommodating future increases in computing power demand and technological iterations.Continuous Innovation, Intelligent Cooling AheadAccording to the "Open Rack V3" white paper, liquid cooling penetration in hyperscale data centers is expected to exceed 40% by 2025. Southco continues to invest in R&D to iterate floating mechanism technology:1. Exploring lightweight high-performance materials (like PPSU thermoplastic) to reduce weight while maintaining strength.2. Advancing intelligent sensor integration for real-time monitoring of key parameters like flow and temperature, providing data for predictive maintenance and energy efficiency optimization.3. Deepening ecosystem collaboration and standardization to promote liquid cooling interfaces in higher density, lower TCO, and broader applications.As liquid cooling technology transitions from optional to essential, Southco's "Blind Mate" represents a precision engineering product innovation, and a profound understanding of cooling challenges in the data center industry. By integrating over a century of precision mechanical design expertise with innovative three-dimensional dynamic tolerance control technology, Southco strives to help global data centers break through cooling bottlenecks, building a more efficient, reliable, and greener foundation for computing power, empowering infinite possibilities in the digital age.For more information, please click here for more details.

Global Unichip Corp. (GUC), the Advanced ASIC Leader, announced a collaboration with VSORA to deliver turnkey ASIC design services supporting the onschedule tapeout of the Jotunn8 datacenter AI inference processor. Through this partnership, GUC showcased deep capability in complex chiplet architectures and HBM3E integration using 2.5D advanced packaging technology, reinforcing the company's strength in accelerating customer innovation with optimized performance and efficiency.Jotunn8 is VSORA's flagship AI-inference chip, engineered exclusively for inference workloads rather than training. It delivers ultra-low latency and very high throughput by overcoming the memory wall bottleneck, making large-scale, cost-efficient AI deployment viable.GUC delivered comprehensive design services for Jotunn8, managing the entire process from  netlistin through manufacturing. The solution integrates GUC's Advanced Packaging Technology (APT) IP portfolio, including 17.2 Gbps GLink-2.5D die-to-die interconnect and 8.4 Gbps HBM3E PHY & Controller, leveraging 3x-reticle 2.5D advanced packaging and 5nm process technology.GUC's contributions included complex physical design, chiplet partitioning and integration, as well as cooptimization of signal, power, and thermal integrity (SI/PI/TI). The team also achieved considerable IR and power optimization, enabling superior power efficiency and overall system performance. This collaboration positions VSORA to meet the demanding compute and bandwidth requirements of hyperscale datacenter inference workloads and underscores GUC's leadership as a trusted partner for AI and HPC ASIC development."Jotunn8 is Europe's first HBM-equipped datacenter inference processor, delivering unprecedentedoptimization across speed, efficiency, and scalability," said Khaled Maalej, Founder and CEO of VSORA. "GUC's excellence in physical design, die-to-die and HBM IP performance, and advanced packaging expertise played a pivotal role in achieving this milestone tape-out. Their rigorous engineering discipline and collaborative mindset have been instrumental in turning our ambitious vision into silicon reality.""GUC is honored to help bring VSORA's advanced AI processor to market," said Patrick Wang,Vice President and Chief Sales Officer at GUC. "VSORA's 2.5D design presented significant technical complexity. By combining their groundbreaking innovations with GUC's engineering excellence in advanced process and packaging technologies, we successfully enabled the Jotunn8 tape-out milestone. We look forward to supporting VSORA's vision for high- performance inference at scale and partnering on future generations of AI processors."Building on this success, VSORA and GUC are advancing the frontiers of AI compute. By combining deep innovation with execution excellence, the partnership paves the way for a new era of scalable, energy-efficient AI solutions for global data centers.For more information about GUC, please visit.For more information about VSORA, please visit.