Adlink provides robust and reliable hardware platforms, data connectivity and complete Industrial Internet of Things (IIoT) solutions that drive data-to-decision applications across industries.
ADLINK Technology Inc, a global leader in edge computing, introduces two new modules in the 6-CH EU Series digital I/O – the ECAT-4XMO motion control and trigger module, and the ECAT-TRG4 trigger modules. The new modules are a dynamic extension to ADLINK's EtherCAT System and are designed to perfectly complement the EU Series, enabling higher performance in automatic assembly, test, and inspection equipment across a multitude of applications including cell phone glass inspection, battery cell assembly, camera lens assembly and test and glue dispensing machinery, as well as inspection equipment.
The back-end semiconductor manufacturing process refers to the IC packaging and testing that people often hear about. Specifically, the process known as chip probing (CP) is conducted to test the electrical characteristics of each die on the wafer, so that dies with faulty electrical performance can be vetted before packaging, effectively reducing unnecessary manufacturing costs from faulty products.
Semiconductor chips have been the hottest trending topic recently due to their indispensability in all types of applications, including automobiles, mobile phones, military weapons, and space technology, etc. We can't help but wonder, how do semiconductor plants produce chips with such a large variety of functions out of large silicon wafers? The entire procedure involves an extremely important back-end packaging process known as "die bonding," which is to remove the die from the silicon wafer, and then attaching the die to the IC substrate using a conductive medium such as epoxy or gold wire (with epoxy the most common).
The recent global shortage of automotive chips has brought Taiwan's semiconductor industry into the focus of worldwide attention. The real cause of why Taiwan's semiconductor chips are in such great demand is due to their trusted, unwavering quality that's supported and assured by a series of rigorous verification procedures. The electrical measurement performed before integrated circuit packaging is one of the most important steps of verification. To complete this task, the engineering probe station system must be used in conjunction with a variety of test instruments, automatic test equipment and specially designed engineering verification system.
ADLINK Technology, a global leader in edge computing, announced that the MECS-6110 edge server has been verified as an Intel Select Solution for Universal Customer Premises Equipment (uCPE) on CentOS, for deployment of a wide range of edge-based communication, networking and hosted services.
ADLINK Technology, a global leader in edge computing, announced its edge server, MECS-7210, is officially validated as an "NGC-Ready" computing platform. In a configuration with two Nvidia Tesla V100 Tensor Core GPUs, MECS-7210 has been tested for functionality and performance of easy to deploy AI frameworks for machine learning and deep learning.
5G achieves a 20Gbps downlink peak data rate (20 times faster than 4G), a latency as low as 1ms (one tenth of 4G) and a connection density of one million devices per square kilometer (10 times that of 4G) with enhanced mobile broadband (eMBB), ultra-reliable and low latency communications (URLLC) and massive machine type communications (mMTC). On top of that, it supports network slicing, which allows different levels of services to be provided based on user requirements. These advantages make 5G an enabler of cloud computing, IoT, big data analytics, AI, IoV/autonomous driving, AR/VR and a diversity of other innovative technologies or applications.
Digital technologies such as 5G, big data, and AIoT have driven the continuous update of displays and smart applications with reach extending to many vertical markets, one of which is the key market of transportation. During "AUO Tech Forum 2020" hosted by AU Optronics Corp, a dedicated subforum was held for "smart transportation."
Intelligentization has become a key global trend in every industry. AU Optronics Corp. (AUO), a company that has thrived for many years in the field of optoelectronics, recently hosted the "AUO Tech Forum 2020" which invited experts from industry, academia, and government to speak about exciting developments in 4 major fields of intelligentization.
Demand for digital transformations has risen sharply in the post-pandemic era. At the "smart healthcare" sub forum during "AUO Tech Forum 2020," the company and its partners displayed innovative integration of AIoT and display technologies to assist healthcare industries in finding key opportunities for smart upgrades.
