LB Semicon is planning to offer fan-out wafer-level package (FOWLP) service next year at the earliest. The company completed the development of relevant technologies earlier this year and has been testing them with an analog chip customer since the first quarter. LB Semicon will likely offer FOWLP for RF and power management ICs.
STAr Technologies, a leading supplier of semiconductor reliability test systems, today announces the sale of Accel-RF HTOL Burn-In test systems to top semiconductor foundries in Taiwan. Accel-RF Instruments Corp., a STAr Technologies Group company, located in San Diego, U.S.A...
Global Unichip Corp. (GUC), the leader in Advanced ASIC, announced that they have silicon proved their 7.2 Gbps HBM3 solution, using SK hynix's first available HBM3 samples. The platform was demonstrated at the Partner Pavilion of the TSMC 2022 North America Technology Symposium; it contained an HBM3 Controller, a PHY, GLink-2.5D die-to-die interface, and a 112G SerDes...
DIGITIMES Research report shows that Taiwan's ICT industry development has shifted from focusing on hardware to hardware/software integration models. The industry is combining big data analysis and AI applications in public IoT to facilitate the development of smart city management...
Quectel Wireless Solutions, a global IoT solutions provider, is continuing to build on the successful EMEA roll-out of its Connectivity-as-a-Service (CaaS) and is now launching global connectivity sales in the Asia Pacific region...
As countries continue to lift lockdowns, people's lives and business activities will soon recover while the world enters an era of coexistence with the virus, or so-called the "New Normal." DataVan (3521.TWO) adopted it as the theme at COMPUTEX this year to showcase a series of smart retail solutions aimed at supporting retail businesses to rapidly adapt to post-pandemic consumer behaviors and...
ADATA Technology, a leading manufacturer of industrial-grade DRAM modules and NAND Flash products, today announces the industrial-grade ADATA 31C series 112-layer 3D NAND (BiCS5) solid state drives (SSD) utilizing the SATA III interface. They include the ISSS31C 2.5-inch, IM2S31C8 M.2 2280, and IM2S31C4 M.2 2242 SSDs...
With the deep integration of the new generation of information technology and manufacturing industry, and the digital transformation and upgrading, digitalization is currently intensively filling every link of production and manufacturing...
United Microelectronics Corporation (UMC) announced today that the Science Based Targets initiative (SBTi) has approved its emissions reduction targets, making the Company the first semiconductor foundry globally to obtain SBTi validation of climate goals. This marks a critical step in UMC's roadmap to achieve net zero emissions by 2050.
Digi-Key Electronics, which offers the world's largest selection of electronic components in stock for immediate shipment, announced that it has hired Mike Slater as its new vice president of global business development. In his new role, Slater will oversee the company's worldwide customer and supplier development strategy.
