"We have a lot of big plans for it and we're working with Hynix Semiconductor to launch a replacement for flash in the summer of 2013 and also to address the solid-state drive market," said Stan Williams, senior fellow at HP Labs.

Toshiba Corp. said Wednesday it aims to significantly boost its share in the liquid crystal display television market in the Philippines from 4 percent in fiscal 2010 to 20 percent in fiscal 2013 through March 2014.

Ben Bernanke and the Federal Reserve did not offer ailing markets the short-term salve they were looking for Tuesday with an announcement of additional asset purchases in a bid to stimulate US growth, but the central bank did signal that its accommodative interest rate policy will remain in place until at least mid-2013.

We won't call it OMAP 6, but the 20nm chip that is planned as a successor of OMAP 5 should enable true all day computing...

Smartphones and tablets will be the first devices to use ARM's upcoming Cortex-A15 processor, and will be available starting late 2012 or early 2013, said James Bruce, the US mobile segment manager at ARM.

China aims to bring online at least 1 gigawatt of solar power capacity annually from 2013 under its "Golden Sun" pilot program, aided by increases in subsidies to boost the domestic solar industry, the Ministry of Finance said

The Nikkei business daily recently reported that the resistive random access memory chip to be developed by Elpida and Sharp could write data 10,000 times faster than NAND flash memory technology, while consuming less power. The next-generation memory chip is expected to be commercialized around 2013.

Kyocera is ramping up its annual production to 600MW this year - an increase of 50% over the previous year - to meet growing demand in countries such as Japan, US, Germany, France and Italy, the company says.

Renesas Electronics has announced it will cut about 5,000 jobs mostly in the current fiscal year and completed by March 2013. It also revealed plans to use outside foundries on all of its 28nm and smaller geometry semiconductor products.

Samsung Electronics expects global smartphone sales to double to 393 million units by 2013, according to the head of the company's mobile communications business.

Thin-film integrated passive devices (IPDs) have the potential to extend wafer-level packaging and through-silicon via (TSV) technology to many IC package solutions and the discrete passive component industry. This market could expand from US$600 million this year to reach beyond US$1 billion by 2013.