DIGITIMES regularly interviews leading industry executives, inviting them to talk frankly about the technology issues and the business challenges that need to be addressed in an industry that is marked by constant change. We always welcome the opportunity to discuss industry trends and issues face-to-face, via email or during a conference call, especially for companies that are targeting the Greater China market.
Please contact us if you're interested in arranging an interview.
All-round OSAT: Q&A with PTI CEO Boris Hsieh
Taiwan-based Powertech Technology (PTI) is one of the world's top OSATs with major backend orders from non-Korean memory vendors. PTI has just completed a top...
Memory-centric solutions for next 20 years: Q&A with Macronix chairman Miin Wu
Taiwan-based Macronix International has developed into the world's largest supplier of ROM chips and second biggest maker of NOR flash memory chips after experiencing...
Advanced packaging, mini LED rising as new growth driver: Q&A with Kulicke & Soffa SVP CP Chong
US-based semiconductor assembly equipment supplier Kulicke & Soffa (K&S) is optimistic that 5G and AI applications will drive demand for advanced IC packaging...
Storage market to return to growth track in 2020: Q&A with Pure Storage CEO Charlie Giancarlo
Pure Storage, an all-flash array storage product vendor, has seen double-digit growths that are far stronger than those of other major vendors who mostly have...
Memory long-term outlook promising: Q&A with Micron EVP Sumit Sadana
The memory-chip market conditions will start to improve later in 2019, followed by several years of prosperity, according to Sumit Sadana, executive VP and chief...
Data is like crude oil in new tech era, says Applied Materials VP Erix Yu
After progressing from the PC and network generation in 2000-2010 to the mobile device and social networking generation during 2010-2020, the ever-advancing tech...
Spansion gearing up for SLC NAND
Spansion has started sampling the company's first single-level cell (SLC) NAND flash memory, built using SK Hynix' 4Xnm process technology, and packaged and tested...
The NAND flash boom: Q&A with Phison chairman Khein Seng Pua
Demand for NAND flash application to eMMC, SSDs and USB 3.0 devices is expected to take off in 2012, according to chairman Khein Seng Pua for IC design house Phison...
Aiming big: Q&A with A-Data chairman Simon Chen
Hit by poor market conditions in 2008, A-Data Technology saw its first annual loss since it was founded in 2001. However, the memory module house made a turnaround...
Kingston playing supportive role in Taiwan DRAM rescue: Q&A with company co-founder John Tu
Kingston Technology, the US-based memory module maker who has long been a supportive partner for Taiwan's financially-distressed DRAM makers during difficult times,...
Efficiency, differentiation, time-to-market and localized service are keys to probe card success: Q&A with FormFactor CEO Mario Ruscev
FormFactor, a leading provider of advanced wafer probe cards, has inevitably taken a hit to its operations as a result of the tough economic times. Due to the...
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