Autonomous driving technology is maturing, and a future in which cars entirely drive themselves is quickly approaching in the rearview mirror. Yet safety and trust remain crucial barriers to overcome before fully autonomous driving becomes a reality, and a key part of this is the "eyes" of the car.

As AI chips continue to grow in size, the shift in advanced packaging from 300 mm wafers to square panels is becoming clearer, driving parallel development of new packaging technologies including FOPLP, CoPoS, and Glass Core. Manz Asia general manager Robert Lin said yield will determine whether Glass Core can move into mass production.

As physical AI and robotics draw unprecedented market attention, a key bottleneck is clogging the deployment pipeline: quality, real-world physical data. To move applications from the lab to real-world deployment, companies are getting creative in overcoming this obstacle while balancing affordability, stability, and data volumes.

Ken Phua, former Arm China co-CEO, spent 25 years abroad building someone else's business model. He came home to Singapore to build his own.

Amid escalating geopolitical tensions, defense awareness is rising rapidly worldwide, with drone and counter-drone technologies becoming key areas of development for governments and defense industries. Taiwan is also continuing to upgrade technologies for radar detection, missile defense, and other military systems.

Global AI computing is rapidly moving beyond single-GPU systems toward AI Factory architectures, where agentic AI and inference workloads are pushing data centers to rely on networking, optics, packaging, cooling, power delivery and software co-design rather than raw accelerator counts. In a DIGITIMES interview, Nvidia Senior Vice President of Networking Gilad Shainer said the real unit of computing is now the entire data center, not an individual server.

Taiwan's role in the global AI supply chain is shifting from manufacturing toward engineering, Nvidia networking senior vice president Gilad Shainer told DIGITIMES in an interview. The island, he said, is increasingly serving as an engineering partner for next-generation AI factories rather than simply an assembler.

The 2026 OCP APAC Summit will take place in Taipei on August 11-12. Ahead of the event, Lightmatter founder and CEO Nicholas Harris spoke exclusively with DIGITIMES about the company's advantages after joining the Nvidia NVLink ecosystem, its technology roadmap and the importance of close collaboration with Taiwan's supply chain.

Taiwan's hardware manufacturing sector leads globally, but the country's level of investment in cybersecurity software and identity governance still ranks in the back half of the Asia-Pacific region, SailPoint Taiwan, Hong Kong, and Macau managing director Simon Tai told DIGITIMES in an interview. As the tech industry speeds up digital transformation, remote collaboration, outsourced workflows, and AI agents are increasingly common in enterprise operations, shifting the focus of corporate cybersecurity defenses.

Nvidia Senior Vice President of Networking Gilad Shainer said the company is building the key network architecture and optical interconnect technologies needed for AI factory deployments at scale, in a DIGITIMES interview ahead of the OCP APAC Summit on August 11-12, 2026. He said the biggest shift in AI factories is that the computing unit is no longer a single server but the entire data center, while Nvidia's announcement that co-packaged optics (CPO) switch has entered mass production signals a new round of upgrades for the optical communications industry and the AI networking market.

As automotive electronics, electrification, software-defined vehicles (SDVs) and AI-defined vehicles (AIDVs) reshape the global auto industry, Taiwan's Ken Sean Industries is accelerating efforts to build a non-China automotive supply chain in partnership with leading Taiwanese electronics companies and Japanese automakers.

Rapidus is treating advanced packaging as a central part of its 2nm foundry strategy, not a downstream assembly service. The Japanese chipmaker aims to connect design enablement, front-end wafer processing, chiplet integration, packaging, testing and manufacturing data through its Innovative Integration for Manufacturing (IIM-1) model.

Philippe Notton has spent nearly 20 years traveling to Taiwan roughly once a month. That rhythm—born from his time at MStar Semiconductor and deepened across four companies on three continents—shaped how he thinks about building chips, building companies, and building Europe's only independent advanced CPU business.

As AI's bottleneck shifts from chips to capital, Compute Labs pitches GPUs as financeable assets.

TSMC raised its 2026 capital expenditure forecast to US$60–64 billion during its second-quarter earnings conference, with a substantial share earmarked for the US. Although Singapore tried to attract a TSMC fab, the chipmaker ultimately chose not to commit. Vanguard International Semiconductor Corporation (VIS), however, has received strong backing from TSMC for VisionPower Semiconductor Manufacturing Company (VSMC), its joint venture with NXP Semiconductors. VSMC's new 12-inch foundry in Singapore is scheduled to formally open in late September. DIGITIMES was granted an exclusive early look inside the facility.