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REALTIME NEWS
Commentaty: Huawei’s Kirin's road to 2027
Tomorrow's Headlines
Oct 14, 17:01
Analysis: What's GlobalFoundries calculus behind its US$2 billion entry into TSMC’s CoWoS ecosystem
Tomorrow's Headlines
Oct 14, 17:01
ProLogium shifts solid-state battery focus to AI and aviation markets
Tomorrow's Headlines
Oct 14, 17:01
Commentary: What is Musk's plan to catch up with TSMC
Tomorrow's Headlines
Oct 14, 17:01
Commentary: The many hurdles of Apple HomeView
Tomorrow's Headlines
Oct 14, 17:01
Oct 14, 14:52
ASML's record 3Q26 sales expose a capacity gap for AI chip demand through 2028
Oct 14, 14:32
Nvidia's share of China's AI chips falls by a third while Huawei gains
Oct 14, 15:25
SK Hynix HBM4 equipment installations reportedly face partial deferral to 2027
Oct 14, 15:08
Microsoft adds US$132.5 billion in lease commitments—but AI capacity takes years to build
Oct 14, 14:19
Elon Musk says Micron is 'reasonable' on memory prices while others are 'extortionate'
LATEST STORIES
7 days news
Energy Taiwan 2026 opens with record international participation
Oct 14, 23:59
SUSTAINABILITY
300mm fab equipment spending to hit US$227 billion by 2029, SEMI says
Oct 14, 17:18
SEMICONDUCTORS
BOE struggles with glass breakage at US$9.4 billion OLED plant as it seeks Apple iPad orders
Oct 14, 17:11
EAST ASIA
Tata's flagship chip fab faces pressure from its own shareholders
Oct 14, 16:50
SEMICONDUCTORS
ASE expands PowerSiP platform to improve AI data center power efficiency
Cerebras CEO reveals the capacity shortfall behind OpenAI's turn to Nvidia GPUs
Kingboard Laminates raises thin-cloth laminates, prepreg prices 15% in eighth hike of 2026
China's smartphone slump: Can Apple's new lineup light a spark?
Huawei's Kirin 9050 Pro delivers 53.5% density gain; tighter 3D bonding next for 2027
TSMC and MediaTek alumni lead Taiwan's new wave of deep tech startups
Applied Materials CEO says AI race hinges on technology and capacity
Memory bottlenecks drive HBM shift to 8-layer stacks
AVC unveils 6MW In-Row CDU at OCP, adds predictive cooling
AI computing demand drives water management integration at Tianyi
Wiwynn unveils CPO compute system with GUC and Ayar Labs
Tsang Yow's semiconductor revenue share reaches 12%
Ubiqconn satellite revenue jumps 175% as 3Q26 operations recover
Largan chairman casts doubt on Micro LED links for AI data centers
Taiwan IC substrate maker Xinxing halts some machinery after fatal workplace accident
JCET redirects Korean factories towards AI to counter weak smartphone growth
Google unveils Gemini 4 Argon, balancing frontier capabilities with rigorous safety standards
OpenAI in talks to buy cybersecurity firm Trail of Bits, report says
AI chip competition shifts to data-center efficiency as memory, interconnect limits bite
Broadcom executive says chipmakers must tackle packaging, power limits together
Samsung, AMD validate CXL memory for AI servers
LG, Bosch team up on automotive chiplets
LGD's KRW104.1B auto LCD module sale collapses
Cisco expands AI networking with new chips, SONiC, cross-site deployment
Cisco, Nvidia target high-speed optical interconnects with 4x USFP density
AI accelerator growth shifts toward value as custom ASICs move upmarket
More news
BIZ FOCUS
Oct 14, 08:00
Hybrid Copper Bonding - A Manufacturing Lever for The AI Era
Wednesday 14 October 2026
Practical Insights & Industry Ideas
Wednesday 14 October 2026
GMIF 2026 Awards: Samsung, SanDisk, BIWIN, and Others Honored
Tuesday 13 October 2026
Chenbro unveils AI rack-level solutions at 2026 OCP Summit
MOST-READ
TSMC 3nm, 2nm, and CoWoS stay tight as AWS, MediaTek, TPU shift capacity
TSMC locks in 3-6% wafer out price hikes for 2027
Musk's Memphis move puts xAI at the center of his empire
TSMC, Intel named as Musk's Terafab ambitions face reality check
GlobalFoundries wins US$2 billion TSMC interposer deal, closing a US packaging gap
Beyond 16 layers: HBM stacks test advanced packaging equipment makers
Chinese memory supply is disruptive to pricing, Acer's Jason Chen says, as shortages ease
MULTIMEDIA
K-Safety Expo 2026: Safety, rewired, AI takes the front line at the edge of Busan blue
TSMC, Intel, and Musk's Terafab
As Elon Musk's Terafab ambitions advance, the realities of modern silicon manufacturing become increasingly apparent.
Analysis: Musk keeps Terafab in-house, shifting execution risk onto his own companies
Musk limits TSMC to possible Terafab sublease; Intel says it will stay involved
TSMC Texas-Terafab buzz drives Taiwan contractors to move fast
...More
EV
Wednesday 9 September 2026
Analysis: When 72% of the world's EV batteries are Chinese, one defect travels
Analysis: China's EV rebate cut pushes exporters from volume to value
Wednesday 14 October 2026
LG, Bosch team up on automotive chiplets
Wednesday 14 October 2026
Chinese automakers face three hidden barriers in European expansion
Wednesday 14 October 2026
TECH
Wednesday 14 October 2026
TSMC, Intel, Samsung seek to break AI chipmaking's next barrier through early technology integration
AI Server tracker: Taiwan's AI server chain grew 55% in September, but the growth narrowed to fewer suppliers
Tuesday 13 October 2026
TSMC, ASML eye 12-inch photomasks to unlock High-NA EUV's full-field potential
Monday 12 October 2026
Exclusive: Chinese notebook ODMs win HP, Dell orders, pressuring Taiwanese suppliers
Wednesday 7 October 2026
ASIA
Thursday 10 September 2026
India's fraud office seeks a Xiaomi probe as the market it once led shrinks around it
Huawei's Kirin 9050 Pro delivers 53.5% density gain; tighter 3D bonding next for 2027
Wednesday 14 October 2026
BOE struggles with glass breakage at US$9.4 billion OLED plant as it seeks Apple iPad orders
Wednesday 14 October 2026
China's smartphone slump: Can Apple's new lineup light a spark?
Wednesday 14 October 2026
OPINIONS
Tuesday 13 October 2026
Column: From 3D NAND to 3D DRAM — how vertical stacking is reshaping memory chip manufacturing
Podcast highlights: Is Elon Musk using TSMC talks as leverage against Intel and Samsung?
Tuesday 13 October 2026
Analysis: Musk keeps Terafab in-house, shifting execution risk onto his own companies
Thursday 8 October 2026
DIGITIMES Insight: HBM expansion raises the bar for memory offload
Wednesday 7 October 2026
TOPICS
TSMC, INTEL, AND MUSK'S TERAFAB
HUAWEI
MICRO LED
ALTERNATIVES TO LCD
SPECIAL REPORTS
Monday 12 October 2026
Chinese government and industry make full push into AI glasses development: AR display integration and lightweighting gain traction
DIGITIMES notes that China continued to advance smart glasses policies from the central government to local governments in 2026, driving both enterprise production and consumer purchase subsidies.
Friday 2 October 2026
Global annual AI server shipments, 2025-2026
Continued advances in top-tier LLM capabilities, coupled with the potential for business automation enabled by agentic AI, are prompting major North American cloud providers, Neo Clouds, and leading AI labs to accelerate AI data center buildouts in 2026.
Thursday 1 October 2026
SiC substrate market shows signs of recovery, driven by demand from vehicles, energy and AI infrastructure
DIGITIMES has observed that since Tesla equipped the Model 3 with a traction inverter integrated with SiC power modules in 2018, the application of SiC power devices in the electric vehicle (EV) sector has gradually expanded, prompting suppliers to aggres 8_s.jpg
Thursday 17 September 2026
Physical AI drives autonomous driving upgrade; three efficiency factors lift AI accelerator demand
End-to-end autonomous driving has become the mainstream technology path, and the inference demand created by Physical AI in autonomous driving systems is, in turn, reshaping automotive system-on-chip (SoC) design.
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