Realtime news
Memory chips
  • Investments in new fab projects starting construction in 2020 to reach nearly US$50 billion
    Investments in new fab projects starting construction in 2020 are expected to reach nearly US$50 billion, up about US$12 billion from 2019, according to SEMI.
  • OSE has seen clear order visibility through the end of 2019
    Memory modules specialist Orient Semiconductor Electronics (OSE) is expected to see its September revenues hit an all-time high for the third consecutive month, driven by a pull-in of orders for NAND flash devices, as well as orders for EMS services, according to market watchers,
  • Total semiconductor capital expenditures are forecast to slip 8% in 2019
    Capex spending for memory ICs was the driving factor behind strong increases in industry-wide capex spending over the past two years. Most of those upgrades and expansion plans are now completed or have entered their final building phases. As a result, memory capex is forecast to account for 43% of...
  • China's move to improve self-sufficiency for semiconductors is gaining momentum
    China's move to improve self-sufficiency for semiconductors is gaining momentum - in line with the country's national policy and in the wake of the trade war with the US - with DRAM startup ChangXin Memory Technologies moving in equipment at its 12-inch fab. CXMT...
  • China developing homegrown DRAM memory
    China-based DRAM chipmaker ChangXin Memory Technologies (CXMT, formerly Innotron) has kicked off 12-inch fab equipment move-in in the third quarter, aiming to start commercial runs for part of its production lines by the end of 2019, according to industry sources.
  • The role of Taiwan's high-tech industry is expected to improve amid the trade tensions
    Trade disputes between Japan and South Korea will likely result in fundamental changes to both countries' high-tech industry supply chains, while opening the door for enhanced cooperation between the Korean and Taiwanese high-tech sectors, according to Pei-Lin Pai, VP of technology R&D for Winbond...
  • Macronix saw its revenues climb 17.2% from a year earlier
    Macronix International and Winbond Electronics have reported sequential increases in August consolidated revenues of 24.9% and 3.1%, respectively.
  • TSMC has seen strong demand for its 7nm manufacturing capacity
    The overall semiconductor market may be weak, but TSMC has seen strong demand for its 7nm manufacturing capacity, with orders, particularly those from Chinese clients, already extending to the first half of 2020, despite uncertainties...
  • Micron CEO Sanjay Mehrotra has paid a visit to China to meet executives at Tsinghua Unigroup
    Micron Technology CEO Sanjay Mehrotra recently paid a visit to China, during which he reportedly met executives at Tsinghua Unigroup, raising speculation about potential cooperation between the two companies.
  • Chip sales during the initial six months of 2019 plunged by 13.9% compared to a year earlier
    Chip sales during the initial six months of 2019 plunged by 13.9% compared to a year earlier, the biggest drop in a half since the first half of 2009, according to IHS Markit.
  • Spending on 300mm fab equipment will slowly recover in 2020 after the 2019 downturn
    Spending on 300mm fab equipment will slowly recover in 2020 after the 2019 downturn and take off in 2021 to log a new record high topping US$60 billion, only to lag again in 2022 and rebound to an all-time peak in 2023, according to SEMI.
  • Orders for custom-designed processors have been rising from China
    Chinese IT firms have been keen on reducing reliance on US supplies in the wake of the US-China trade war. Taiwan's IC design service providers used to land orders from China-based clients for mainly mining processors and high-performance computing chips, but have seen more of the customers engaged...
  • Worldwide sales of semiconductors posted a year-over-year decline
    Worldwide sales of semiconductors posted a year-over-year decline for the seventh consecutive month in July 2019.
  • Semiconductor spending of the world's top OEMs will face the steepest decline in a decade
    Impacted by softening markets and rising uncertainty in global trade and economy, semiconductor spending of the world's top OEMs will face the steepest decline in a decade. According to IHS Markit, worldwide top OEMs semiconductor spending will amount to US$316.6 billion in 2019, down 7% from 2018.
  • Nanya has revised upward its bit shipment guidance
    DRAM chipmaker Nanya Technology has revised upward its bit shipment guidance for the third quarter of 2019 to over 25% growth sequentially from the mid-teen percentage increase estimated previously.
  • Yangtze Memory has kicked off volume production of 64-layer 3D NAND chips
    China's Yangtze Memory Technologies (YMTC) has kicked off volume production of 64-layer 256Gb TLC 3D NAND chips, according to indsutry sources.
  • Lite-On Technology has disclosed it will sell its SSD business unit
    EMS provider Lite-On Technology has disclosed it will sell its SSD business unit consisting of personnel, production equipment, technology and proprietary intellectual properties, inventory and client relations to Toshiba Memory at a tentative price of US$165 million.
  • DRAM and NAND flash players are expected to see demand from servers and datacenters to rise
    Many IT firms from industries including DRAM and NAND flash and optical fingerprint sensor are optimistic about demand in the second half of 2019, but the same may not go for polarizer makers. DRAM and NAND flash players are expected to see demand...
  • GigaDevice has unveiled 32-bit general-purpose RISC-V MCU
    China-based GigaDevice Semiconductor has unveiled what the company claims is the world's first 32-bit general-purpose MCU based on RISC-V architecture, with the product samples and development tools available now.
  • DRAM and NAND flash demand from datacenters to increase in 2H19
    DRAM and NAND flash demand for server and datacenter applications is expected to pick up as early as the third or fourth quarter of 2019, and will become robust next year, according to industry sources.
  • CEO of Tsinghua Unigroup's DRAM business group Shih-Wei Sun
    Shih-Wei Sun, ex-CEO of Taiwan-based foundry United Microelectronics (UMC) who joined China's state-owned Tsinghua Unigroup in 2017, has been recently appointed as president and CEO for Wuhan Xinxin Semiconductor Manufacturing (XMC).
  • Advantest Taiwan chairman CH Wu
    Testing demand for high-end 5G SoCs has emerged and that for memory chips is set to pick up in early 2020, which will drive revenue increases at Advantest, a major Japan-based supplier of semiconductor testing equipment, according to company sources.
  • Tsinghua Unigroup to set up DRAM HQ in Chongqing
    China's state-owned Tsinghua Unigroup has clinched a deal with the Chongqing municipal government to build its DRAM operations headquarters, R&D and manufacturing facilities in the country's southwestern city, according to industry sources.
  • Micron
    Micron Technology is already engaged in risk production of DRAM chips built using 1z-nanometer process technology at its Hiroshima fab in Japan, according to the US memory chip vendor. The more advanced manufacturing node will be ready for mass production at Micron's Taiwan-based plant in the first...
  • Semiconductor components see rising demand from 5G applications
    With 5G business opportunities starting to emerge, CCL makers have been keenly increasing their capacity to satisfy rising demand from the PCB industry. Meanwhile, suppliers...

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