IC manufacturing
  • UMC enters Sony CIS supply chain
    UMC's acquisition of Mie Fujitsu Semiconductor apparently has fulfilled two of its major strategic purposes: to expand its presence in the Japanese maket and the niche market. Through the wholly-owned Japanese subsidiary, now renamed United Semiconductor Japan (USJC), the Taiwan-based foundry house...
  • CIS demand from the car industry has been stable
    Global makers of CMOS image sensors (CIS) are expected to embrace explosive demand for higher-specs CIS devices for application to autonomous vehicles in addition to handsets, which in turn will provide more opportunities for Taiwan-based backend firms, according to industry sources.
  • Acquiring MIFS is in line with UMC's increased focus on specialty process nodes
    United Microelectronics (UMC), through its takeover of Mie Fujitsu Semiconductor (MIFS), has entered the supply chain for Sony's CMOS image sensors, according to industry sources.
  • Global semi equipment sales to rebound in 2020
    Global semiconductor manufacturing equipment sales will drop 10.5% to US$57.6 billion in 2019 from last year's historic peak of US$64.4 billion but stage a 2020 recovery and set a new high in 2021, according to SEMI.
  • GCS and Epistar are strengthening their partnerships
    Pure-play compound semiconductor wafer foundry Global Communication Semiconductors (GCS) has enhanced its strategic partnership with Epistar by investing in Epistar's China-based foundry subsidiary Episky.
  • TSMC to end 2019 with growth
    The world's top pure-play foundry is set to wrap up 2019 with strong sales performances, thanks to impressive contributions from advanced manufacturring processes. TSMC is also on course to enter commerical production in first-half 2019...
  • ASE will see strong orders for 5G mobile SoC backend services
    Robust orders for 5G smartphone application processors from the world's major Android phone vendors will allow backend house ASE Technology Holding to enjoy a particularly strong first quarter of 2020, according to industry sources.
  • TSMC 7nm process delivery lead times stretched to over 100 days
    TSMC is poised to post revenue growth of up to 5% on year in 2019, with sales for the fourth quarter set to meet its guidance range, according to market observers.
  • Equipment makers set to have a strong year in 2020
    With capital expenses by semiconductor firms in Taiwan and China set to regain expansion momentum in 2020, equipment supply chain players are expected to see a bright year for their operations in 2020, according to industry sources.
  • Sony is expanding CIS offerings
    Taiwan's CMOS image sensor (CIS) packaging specialists including Kingpak Technology, Xintec,VisEra Technologies and Tong Hsing Electronic Industries are expected to benefit significantly from Sony's move to expand CIS capacity and launch smart CIS devices in 2020 to meet increasing demand for 5G, AI...
  • TSMC has reported sales increase for November
    Taiwan Semiconductor Manufacturing Company (TSMC) saw its November revenues increase 1.7% sequentially, while revenues at United Microelectronics (UMC) and Vanguard International Semiconductor (VIS) slid 4.8% and 7.6%, respectively.
  • TAiwan exports grew on year in November
    Taiwan's exports totaled US$28.58 billion in value in November 2019, dropping 1.4% sequentially but rising 3.3% on year, while the corresponding imports reached total value of US$24.30 billion, slipping 2.9% sequentially but growing 5.8% on year, according to the Ministry of Finance (MOF).
  • Sony sees strong CIS sales
    TSMC has obtained orders for CMOS image sensors from Sony, and will fabricate the chips using 40nm process technology at Fab 14A in Tainan, southern Taiwan, according to a recent Chinese-language Commercial Times report.
  • Nuvoton will acquire PSCS in an all-cash deal valued at US$250 million
    Acquiring Panasonic's loss-making semiconductor business will have a negative impact on Nuvoton Technology's profitability in the short term, and it may take time for the business to turn profitable, according to Arthur Chiao, chairman for Nuvoton and Winbond Electronics.
  • Qualcomm has launched new Arm-based processors for notebooks
    Although the memory market looks to be heading towards a recovery in 2020, suppliers are cautious about expanding supply. Winbond is building a new plant in Kaohsiung, southern Taiwan, with completion originally slated for year-end 2020 and commerical production for 2021. But now the company has now...
  • TSMC on track to start 3nm production in 2022
    TSMC has been fast advancing its manufacturing processes. It is on track to move 5nm node to commercial production in the second half of 2020, and will soon break ground for a 3nm facility where volume production will start in 2022. Next...
  • LTCC to be mainstream packaging material for mmWave modules
    The market for packaging materials for 5G mmWave transmission modules is set to heat up in 2020, with LTCC (low temperature co-fired ceramic) likely to replace LCP (liquid crystal polymer) as the mainstream material, according to industry sources.
  • Demand from the Wi-Fi 6 sector is picking up
    MediaTek and Realtek Semiconductors are both gearing up to ramp up their output of Wi-Fi 6 (802.11ax) chips in 2020, according to sources at IC testing solutions providers.
  • Taiwan's IC backend service providers have seen sales grow in 2H19
    Despite the ongoing US-China trade tensions, Taiwan's IC packaging and testing industry is still expected to see second-half 2019 revenues grow from the first half thanks to rising demand for 5G-related applications, according to Digitimes Research.
  • Prospects bright for silicon wafer suppliers, fab toolmakers
    Taiwan-based silicon wafer suppliers and fab toolmakers, particularly those in the supply chain of TSMC, have enjoyed a ramp-up in orders recently and become optimistic about their sales outlook for 2020.
  • Qualcomm
    TSMC uses its N7, the foundry's 7nm process without EUV, to fabricate Qualcomm's latest flagship processor, Snapdragon 865 series. Nevertheless, its Snapdragon 765 chips are being manufactured using Samsung's EUV-based 7nm process technology.
  • TSMC to kick off 3nm production in 2022
    TSMC is firmly on track to move 5nm process technology to commercial production in the first half of 2020 and will kick off production of chips built using a newer 3nm process node in 2022, according to JK Wang, the firm's senior vice president for fab operations.
  • Semiconductor sales are expected to decline in 2019
    With revenues plunging by 14.7% in the third quarter, the global semiconductor market appears destined for a year of double-digit decline despite some signs of growth in the critical memory segment, according to IHS Markit.
  • 5G to see intense competition in midrange phone segment
    Qualcomm has introduced its new 5G SoC lineup - the Snapdragon 865 series for smartphone vendors' flagship models and the 765 series for midrange to high-end ones. But it is the midrange smartphone market segment that is expected to see...
  • Taiwan's IC designers are seeking to form tighter ties with China's foundries
    More Taiwan-based IC design houses are moving to strengthen partnerships with foundries in China so as to land more orders from Chinese brand vendors seeking to cut reliance on US supplies of key semiconductor components, according to industry sources.

Taiwan handsets – 3Q 2019

Taiwan LCD TVs – 3Q 2019

Taiwan LCD monitors – 3Q 2019

Global LCD panel shipment forecast, 2020 and beyond

Global mobile device shipment forecasts, 2020 and beyond: Smartphones, notebooks and tablets

Taiwan semiconductor foundry sector, 2Q19

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