Taiwan-based IC design houses continue to see their downstream clients including distributors stockpile aggressively, and plan to raise their quotes to constrain demand, according to industry sources.

One of the world's main IC industry clusters is being formed at the Southern Taiwan Science Park (STSP), where TSMC operates its major manufacturing site for 5nm process technology.

Demand for OLED is picking up, with Apple's freshly released iPhone 12 family all featuring OLED screens. Now China-based maker CSOT has plans to build a new 8.5g fab in 2021 for making inkjet-printed OLED panels. SK...

With Intel agreeing to sell its NAND flash and storage business including a manufacturing plant in China's Dalian to SK Hynix, Taiwan's memory backend specialist Powertech Technology (PTI), now with 10% of its revenues contributed by Intel, will have to adjust and enhance its customer mix to offset...

Taiwan-based makers received export orders totaling US$50.03 billion in September 2020, increasing 10.0% sequentially and 9.9% on year to hit the highest-ever monthly level, according to the Ministry of Economic Affairs (MOEA).

Display driver IC backend specialist Chipbond Technology and memory modules backend and EMS service provider Orient Semiconductor Electronics (OSE) have formed a long-term strategic alliance to supplement each other in memory backend services and develop new-generation packaging solutions which will...

Equipment suppliers are optimistic about demand coming from the passive component sector, where leading players including Yageo and Walsin Technology have plans for capacity expansions.

Dialog Semiconductor and Globalfoundries have entered into an agreement in which Dialog licenses its conductive bridging RAM (CBRAM) technology to Globalfoundries, according to the companies. The resistive ram (ReRAM)-based technology was pioneered by Adesto Technologies which was recently acquired...

The iPhone 12series are expected to see significant sales, with Apple likely to increase orders for its ecosystem partners. Apple will reportedly increase SLP orders with its PCB suppliers for the iPhone 12 mini, as the smaller-size...

Suppliers of LCD driver ICs have seen an influx of rush orders from panel makers in Taiwan and China who are ramping up their output to meet increasing panel demand from the IT and TV sectors, according to industry sources.

Taiwan's IC packaging materials suppliers, including Niching Technology and Chang Wah Technology (CWTC), have seen their order visibility improve significantly, according to industry sources.

The current tight wire bonding (WB) packaging capacity at Taiwan's IC backend service firms is likely to last beyond the first quarter of 2020 thanks to strong demand from analog and logic IC vendors, according to industry sources.

TSMC as a top-choice foundry partner for HPC (high performance computing) chips vendors will significantly benefit Taiwan suppliers of ABF substrates for processing such chips, according to Taiwan Printed Circuit Association (TPCA)

The year 2020 is a milestone in use of green energy by Taiwan's high-tech industries, according to SEMI Taiwan president and SEMI chief marketing officer Terry Tsao.

TSMC expects revenues from its 5nm manufacturing process to pick up in 2021 with the share to rise from only 8% in 2020 to more than 20%. Meanwhile, as the IT industry continues witnessing insufficient wafer foundry support, backend houses...

Semiconductor equipment maker Foxsemicon Integrated Technology, an affiliate of the Foxconn Group, broke ground for a smart manufacturing plant in Chunan of northern Taiwan on October 15 with total investment estimated at NT$1 billion (US$34.7 million).

Tape COF substrate demand has been falling thanks partly to insufficient foundry support for LCD driver ICs, and may not pick up until the first quarter of 2021, prompting some makers including Chipbond Technology to reduce quotes for tape COF substrates, according to industry sources.

Apple reportedly will have its next-generation AirPods series all adopt system-in-package (SiP) technology, which will significantly boost overall quartz component demand for the popular TWS earbuds in 2021, according to industry sources.

Delivery lead times at Taiwan-based packaging and testing houses have been extended, as fabless chipmakers are striving for capacity support, according to industry sources.

TSMC CEO CC Wei has reiterated his previous remark that the foundry expects to see 5nm process technology to account for 8% of its total wafer revenues this year. The proportion will climb further to nearly 20% or above the level, said Wei at an earnings conference call on October 15.

TSMC expects to post revenues of between US$12.4 billion and US$12.7 billion in the fourth quarter of 2020, which is a 3.4% sequential increase at the midpoint. Gross margin and operating margin for the third quarter are estimated at 51.5-53.5% and 40.5-42.5%, respectively.

GaAs foundry Win Semiconductor and its backend partners including Elite Advanced Laser (eLaser) are engaged in production of VCSEL chips for ToF-based LiDAR scanner for the iPhone 12 Pro series through US-based chipmaker Lumentum, according to industry sources.

Apple's custom-designed ultra wideband (UWB) chip featured in the just-unveiled HomePod mini smart speaker is built using ASE Technology's SiP packaging technology, according to industry sources.

Shipments of Apple's just-unveiled iPhone 12 lineup may reach as high as 80 million units by year-end 2020, as the vendor's more affordable pricing strategy is likely to entice users with older iPhones to upgrade, according to market observers.

The Hsinchu Science Park (HSP), Southern Taiwan Science Park (STSP) and Central Taiwan Science Park (CTSP) generated revenues totaling NT$1,903.688 billion (US$65.03 billion) in January-August 2020, growing 14.24% on year, according to the Ministry of Science and Technology (MOST).