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Chipbond chairman FJ Wu

Chipbond chairman FJ Wu

Chipbond to suspend 5G PA packaging capacity expansion

Jun 17, 16:05

Chipbond Technology will put on hold its 5G PA (power amplifier) packaging capacity expansion originally set to be enforced in the second half of 2019, due mainly to the uncertainties associated with the US trade ban on China's Huawei, according to company chairman FJ Wu.

VIS lands new clients amid trade war, but conservative about 2H19

Jun 17, 13:49

Vanguard International Semiconductor (VIS) is optimistic about longer-term business prospects as it has enjoyed an increase of new clients amid the US-China trade...

Winbond to open new fab in southern Taiwan by 2021

Jun 17, 13:45

Winbond Electronics expects to start operating a new 12-inch wafer plant in Kaohsiung, southern Taiwan by 2021, when the DRAM and flash memory chipmaker has its...

MediaTek reiterates sales guidance for 2Q19

Jun 17, 13:40

Mobile SoC specialist MediaTek expects its sales for the second quarter of 2019 to come within the guidance given previously of 13-21% sequential growth.

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