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NEWS TAGGED WLCSP
Wednesday 10 March 2021
Taiwan OSATs post revenue increases in February
Taiwan-based OSAT providers including ASE Technology, King Yuan Electronics (KYEC) and Tong Hsing Electronic Industries have posted on-year revenue increases for February 2021, and...
Wednesday 3 February 2021
Backend house Xintec expects strong 1Q21
TSMC-invested backend house Xintec expects to enjoy a particularly strong first-quarter 2021 and stable revenue and profit increases for the entire year, thanks to brisk wafer-level...
Monday 26 October 2020
Driver ICs tight supply: Q&A with Chipbond chairman FJ Wu
The supply of display driver ICs has fallen short of demand, while capacities at 8-inch foundries stay tight. Backend houses are mulling raising their quotes to reflect the tight...
Tuesday 20 October 2020
Chipbond, OSE form alliance for flash, 5G RF modules packaging
Display driver IC backend specialist Chipbond Technology and memory modules backend and EMS service provider Orient Semiconductor Electronics (OSE) have formed a long-term strategic...
Tuesday 16 June 2020
Chipbond to strengthen non-driver IC backend services
Display driver IC backend specialist Chipbond Technology is constructing a new plant designed mainly for processing RF and PA components for use in 5G devices, which will significantly...
Thursday 11 June 2020
Winbond leads the era of wearable devices with the launch of HyperRAM WLCSP package
Winbond Electronics Corporation, a leading global supplier of semiconductor memory solutions, today announced the introduction of new HyperRAM products with WLCSP, which reaches an...