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NEWS TAGGED WIREBONDING
Wednesday 27 July 2022
OSATs slowing down mature packaging capacity expansion
OSATs have started slowing down wirebonding and other mature packaging capacity expansions in response to waning chip demand for consumer applications, but leading players such as...
Monday 27 June 2022
Chipmakers focus on heat dissipation in manufacturing process upgrades
High heat dissipation and other thermal management technologies are increasingly required for both front- and back-end chipmaking processes by companies engaged in the automotive,...
Wednesday 22 June 2022
Second-tier OSATs see uncertainty in order visibility for 2H22
Unlike ASE Technology and other first-tier OSATs who still see robust order momentum from their IDM customers, smaller-size players including Greatek Electronics, Lingsen Precision...
Wednesday 25 May 2022
Manpower crunch becoming new normal for semiconductor sector, says ASE chair
Labor and talent shortages will become a new normal for the semiconductor industry, and how to leverage AI, automation and systematization technologies to address diverse market needs...
Thursday 21 April 2022
Packaging material vendors 'rationing' supplies to IDMs, OSATs
Taiwan's packaging materials vendors are "rationing" supplies in serving international IDMs and local OSATs, as their capacity expansion pace lags behind the latter's, according to...
Thursday 21 April 2022
ASE to complete Chungli factory site expansion in 3Q24
ASE Technology is scheduled to complete constructing additional production lines and facilities at its manufacturing site in Chungli, northern Taiwan in the third quarter of 2024,...
Friday 15 April 2022
ASE capacity utilization to stay high for IDMs, HPC chip vendors
Taiwan's leading OSAT ASE Technology is expected to sustain high capacity utilization throughout 2022, bolstered by expanded outsourcing orders from automotive chip IDMs and long-term...
Wednesday 30 March 2022
Smaller OSATs may cut quotes to win wirebonding orders in 2H22
A wirebonding capacity supply glut is arising from fast capacity expansions at OSATs, which may lead them to cut quotes in the second half of 2022 to bolster their capacity utilization,...
Thursday 24 March 2022
China OSAT growing advanced packaging capability
Having hired R&D talent from Huawei's HiSilicon, China's leading OSAT Jiangsu Changjiang Electronics Technology (JCET) has been developing its flip-chip(FC) packaging, 2.5D IC,...
Wednesday 9 March 2022
MediaTek seeing handset AP inventory swell
MediaTek has seen its inventory level for handset application processors (including 4G and 5G ones) swell to 160-180 days from past regular levels of around 100 days, due mainly to...
Monday 7 March 2022
OSATs slowing down wirebonding capacity expansions for 2H22
Taiwan's OSATs are slowing down their logic IC wirebonding capacity expansions as the visibility of orders for processing consumer ICs is still unclear beyond the second quarter of...