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NEWS TAGGED WIRE BONDING
Tuesday 14 September 2021
IC packaging materials distributors enjoy strong wire-bonding demand
IC packaging materials distributors continue to see strong demand for wire-bonding operations despite uncertainties facing sales of notebooks, handsets and other end-market devices...
Friday 10 September 2021
Taiwan OSATs install additional wire-bonding equipment
Taiwan OSATs, including ASE Technology, Greatek Electronics, Lingsen Precision Industries and Orient Semiconductor Electronics (OSE), have all begun to install additional wire-bonding...
Tuesday 31 August 2021
Quotes for wirebonding packaging to rise in 1H22
Backend houses are expected to raise their quotes for wirebonding packaging in the first half of 2022 to reflect higher material costs, according to industry sources.
Tuesday 8 June 2021
Taiwan backend capacity tightens further on COVID cluster infections
Taiwan's backend capacity supply is being further constrained by COVID cluster infections at some OSATs including King Yuan Electronics (KYEC) and Greatek Electronics.
Monday 31 May 2021
Epoxy molding compound supply now 20% short of demand
The global supply of epoxy molding compound for backend applications has fallen short of demand by 20% with delivery lead times extended further, according to industry sources.
Thursday 20 May 2021
Backend houses see strong demand for display peripheral ICs
Backend demand for display peripheral ICs, such as T-Con and TDDI chips, has been robust, and major OSATs such as ASE Technology and Greatek Electronics are busy processing such chips...
Thursday 13 May 2021
Global chip shortage to persist until 2Q22, says Gartner
The worldwide semiconductor shortage will persist through 2021, and is expected to recover to normal levels by the second quarter of 2022, according to Gartner.
Thursday 29 April 2021
ASE raises capex projection for 2021
Taiwan's leading OSAT firm ASE Technology Holding will raise its capex budget by 10-15% to up to US$2 billion for 2021, from the previous estimation of US$1.7 billion, according to...
Tuesday 9 March 2021
Fabless IC firms facing quote hikes at backend partners
Taiwan's IC designers are facing increasingly tight capacity and resultant quote hikes at their backend partners though foundry capacity they booked in fourth-quarter 2020 are being...
Thursday 28 January 2021
Backend firms upbeat about demand for MediaTek chips
Backend houses in the supply chain of MediaTek have expressed optimism about demand for the fabless client's 5G, Wi-Fi 6 and automotive chip solutions in 2021, and are ramping up...
Wednesday 27 January 2021
Logic IC packager Greatek to raise quotes later in 1Q21
Greatek Electronics, a Powertech Technology (PTI) subsidiary dedicated to logic IC packaging, plans to raise its quotes between the end of February and the beginning of March to reflect...
Thursday 7 January 2021
OSE seeking logic chips backend orders after allying with Chipbond
Orient Semiconductor Electronics (OSE), which has struck a long-term strategic alliance with Chipbond Technology, is expected to soon land new logic chips packaging orders from Taiwan's...
Wednesday 23 December 2020
CWTC readies NT$10 billion for leadframe capacity expansions, acquisitions
Leadframe maker Chang Wah Technology (CWTC) has readied NT$10 billion (US$355.05 million) in new funds, including a 5-year syndicated loan of NT$7.2 billion (US$255.6 million) newly...
Tuesday 22 December 2020
Taiwan OSAT firms see clear order visibility through mid-2021
Taiwan-based OSAT services providers have seen clear order visibility through mid-2021, thanks to robust demand for 5G and Wi-Fi chips, power management ICs (PMIC), and display driver...
Thursday 17 December 2020
ASE to set up more smart factories in 2021
ASE Group will complete the establishment of its 18th smart factory by the end of this year, with plans to build seven more intelligent plants in 2021, according to company COO Tien...