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NEWS TAGGED WINWAY TECHNOLOGY
Tuesday 19 April 2022
OSATs say production remains normal in Suzhou amid semi-lockdown
Taiwan-based OSATs including ASE Technology have said their local manufacturing operations in Suzhou remain normal despite the city entering a COVID-induced semi-lockdown, but they...
Friday 15 April 2022
ASE capacity utilization to stay high for IDMs, HPC chip vendors
Taiwan's leading OSAT ASE Technology is expected to sustain high capacity utilization throughout 2022, bolstered by expanded outsourcing orders from automotive chip IDMs and long-term...
Friday 8 April 2022
Testing firms on track to fulfill new product development projects for MediaTek
MediaTek's testing partners including King Yuan Electronics (KYEC) and Sigurd Microelectronics, and IC test interface specialists, such as Chunghwa Precision Test Tech (CHPT), WinWay...
Friday 1 April 2022
IC test interface vendors diversifying into non-handset chip segments
Taiwan's IC test interface specialists including Chunghwa Precision Test Tech (CHPT) are striving hard to strengthen deployments in multiple market segments beyond handsets as demand...
Tuesday 15 March 2022
Wi-Fi 6/6E on track to go mainstream in 2022
Wi-Fi 6/6E will officially go mainstream in 2022 and is set to penetrate across all application segments, which will benefit all the related IC supply chain players including core...
Friday 21 January 2022
Wi-Fi 7 will spark demand for QFN packaging, burn-in testing
With chip vendors (including Broadcom, Intel, MediaTek, and Qualcomm) gearing up for the development of Wi-Fi 7 chip solutions, QFN packaging and burn-in testing demand will be ramping...
Tuesday 28 December 2021
WinWay eyes business opportunity from new smartphone APs in 2022
WinWay Technology, a Taiwan-based high-end test socket service provider, is expected to enjoy robust orders from the top-2 smartphone AP suppliers in 2022 thanks to upgrades in their...
Tuesday 7 December 2021
MediaTek gearing up for robust demand from China handset vendors in 2022
Mobile SoC specialist MediaTek is gearing up for robust demand from its China-based smartphone clients in 2022, as vendors such as Oppo, Transsion and Vivo set aggressive shipment...
Tuesday 30 November 2021
Taiwan firms gearing up for upcoming Nvidia 5nm gaming GPUs
TSMC, ASE Technology and other Taiwan-based backend firms are all gearing up for the launch of Nvidia's Ada Lovelace-architecture RTX 40 series GPUs next year, according to industry...
Friday 26 November 2021
IC test interface vendors poised to embrace booming demand for HPC chips
Peripheral backend supply chain players including makers of high-end customized IC testing sockets, wafer probe cards and burn-in boards, apart from ABF substrates, are all gearing...
Thursday 28 October 2021
Backend firms gearing up to embrace chip demand boom for 5G Android phones
OSATs and IC test solutions providers are all gearing up for a boom in flip-chip (FC) packaging and high-end testing demand for 5G smartphone application processors (APs) featured...
Wednesday 29 September 2021
Testing houses expect promising demand for MediaTek Wi-Fi chips
MediaTek has been improving its product mix by putting increased focus on Wi-Fi chip solutions to meet robust demand for networking devices, which will effectively bolster testing...
Tuesday 7 September 2021
ASE steps up recruiting engineers for 5G, networking, automotive chips
OSAT ASE Technology has kicked off its recruitment campaign with plans to hire 2,000 engineers by the end of this year to deepen its backend deployments for the 5G, networking and...
Thursday 2 September 2021
IC testing interface vendors to enjoy strong demand for new-gen processors
As AMD and Nvidia are warming up for rolling out new-generation CPU and GPU processors in first-half 2022, Taiwan-based IC test solutions providers including Chunghwa Precision Test...
Tuesday 31 August 2021
Quotes for wirebonding packaging to rise in 1H22
Backend houses are expected to raise their quotes for wirebonding packaging in the first half of 2022 to reflect higher material costs, according to industry sources.
May 19, 12:09
Computex Focus: DataVan to showcase new retail solutions for new normal
Thursday 19 May 2022
STAr Technologies unveils one-touch memory test probe card
Wednesday 18 May 2022
Advanced vision AI eliminates potential risks in cleanroom environments for semiconductor and panel manufacturers
Wednesday 11 May 2022
NeoGene unveils novel ultra-thin heat-pipe-array vapor chamber technology for ultra-high-density power battery pack application
Notebook production in China unlikely to be fully restored until July
IC design houses under pressure to drop prices
Brand notebook vendors cut orders for 2022
YMTC sampling 192-layer 3D NAND chips
Datacenters to become biggest consumer of NAND flash in 2023-2024
Apple car team reportedly in talks with Korean and Japanese suppliers
AMD, MediaTek reportedly in talks to form JV
TSMC to raise quotes for advanced, mature process technologies by 10-20%
BYD Semiconductor takes major stake in Energen
Is GF a good buy for Intel?
EV penetration to rise to 30% in 2025, says DIGITIMES Research
Non-foundry IC segments gaining weight in HPC era, says DIGITIMES Research
DIGITIMES Research worldwide notebook shipment update – February 2022
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