Taiwan's pure-play foundry UMC will see clear growth momentum in 2020 come from ever-increasing chips foundry demand for 5G applications, with clients moving actively to pull in shipments...

TSMC Nanjing Company has reported its first quarterly profit for the third quarter, which narrowed its losses to NT$1.41 billion (US$46.1 million) in the first three quarters of 2019...

China-based DRAM chipmaker ChangXin Memory Technologies (CXMT, formerly Innotron) has managed to improve its 19nm process manufacturing yield rates to satisfactory levels, and is...

Taiwan Semiconductor Manufacturing Company (TSMC) and United Microelectronics (UMC) have both seen their China-based wafer fab utilization rates pick up recently, driven by growing...

In incorporating AI-based systems, enterprises must first determine the real purpose of adopting them and should noy use them merely as a tool for data presentation, otherwise the...

Vanguard International Semiconductor (VIS) remains cautious about its outlook for the rest of 2019, citing still high inventory levels at its customers, according to the Taiwan-based...

TSMC is expected to step up the construction of its advanced 3nm wafer fab after securing 30 hectares of land in the Southern Taiwan Science Park (STSP) by the end of 2019, according...

Leading-edge processes, defined as sub-28nm technologies, accounted for the largest portion in terms of monthly installed capacity available in 2015. By the end of 2019, sub-28nm...

China-based pure-play foundry Semiconductor Manufacturing International (SMIC) expects to have its more-advanced 14nm FinFET process ready for volume production by the end of 2019.

Foxconn Technology Group is likely to kick off construction of a 12-inch wafer fab in 2020 in Zhuhai, southern China in cooperation with the city government there, and will operate...

China-based DRAM maker ChangXin Memory Technologies (CXMT) is stepping up DRAM production deployments as it will kick off commercial runs of its production lines by the end of 2019...

TSMC's new 8-inch wafer fab to be built in Tainan will have its capacity mostly fulfill robust orders for automotive chips from STMicroelectronics and other dedicated chipmakers,...

Lite-On Semiconductor, a maker of discrete and analog IC components, is expected to see its second-quarter revenues register a double-digit sequential growth as it will soon kick...

SK Hynix held recently a "topping out" ceremony to celebrate a major milestone of the construction of its new 8-inch wafer fab in Wuxi, China, according to industry sources. The facility...

Robust demand for more content for mobile, Internet of Things (IoT), automotive and industrial applications will drive production of 700,000 200mm wafers from 2019 to 2022, a 14%...

Taiwan led all regions/countries in wafer capacity with 21.8% share, a slight increase from 21.3% in 2017, according to IC Insights. Taiwan first became the global wafer capacity...

Globalfoundries' recent moves have invited speculation that the US pure-play foundry may be looking for a buyer. Does Globalfoundries' majority shareholder, Abu Dhabi's Advanced Technology...

The semiconductor industry is expected to allocate the largest portion of its capex spending for flash memory again in 2019, marking the third consecutive year that flash has led...

The huge annual trade deficit of up to US$375 billion is definitely a major reason for the US to raise tariffs on goods imported from China, but the trade war seems to be more of...

Taiwan Semiconductor Manufacturing Company (TSMC) has disclosed plans to build a new 8-inch wafer fab at its manufacturing site in Tainan, southern Taiwan to satisfy robust customer...

ASE Technology Holding, the parent company of IC packagers Advanced Semiconductor Engineering (ASE) and Siliconware Precision Industries (SPIL), plans to set up an IC testing service...

China-based pure-play foundry Semiconductor Manufacturing International (SMIC) expects to post a revenue decline of 7-9% sequentially in the fourth quarter of 2018, with gross margin...

Winbond Electronics saw shipments of chips built using 38nm process technology ramp up substantially to account for 24% of the chipmaker's total DRAM sales in the third quarter of...

Winbond Electronics will hold a groundbreaking ceremony for its new 12-inch wafer fab in southern Taiwan on October 3, according to the Kaohsiung city government.

International IDMs including STMicrolectronics, Infineon and TI are aggressively developing power devices using third-generation compound semiconductor materials silicon carbide (SiC)...