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NEWS TAGGED WAFER
Tuesday 12 January 2021
UMC 8-inch fab capacity may tighten further
A recent power outage at UMC's 8-inch wafer fabs may exert pressure on its already-tight supply of 8-inch wafer capacity, according to industry sources.
Friday 8 January 2021
Taiwan 2nd-tier IC design houses post record December sales
Taiwan-based second-tier fabless chipmakers including Advanced Power Electronics, Andes Technology, Elan Microelectronics, Fitipower Integrated Technology, M31 Technology and Sitronix...
Thursday 7 January 2021
China to fall far short of IC self-sufficiency goal by 2025, says IC Insights
IC Insights has forecast that China-produced ICs will represent only 19.4% of the country's IC market in 2025, a fraction of the country's "Made in China 2025" goal of 70%.
Wednesday 6 January 2021
Foundries see clearer order visibility for automotive chips
Foundries including TSMC, United Microelectronics (UMC) and Vanguard International Semiconductor (VIS) have seen the visibility of orders for automotive chips extended to the end...
Wednesday 6 January 2021
UMC raises 12-inch foundry quotes
United Microelectronics (UMC) has raised its 12-inch foundry quotes to reflect tight capacity at its fabs, according to the contract chipmaker.
Tuesday 5 January 2021
VIS to disclose details about new acquisition in 1Q21
Eight-inch foundry Vanguard International Semiconductor (VIS) is expected to announce details regarding a new acquisition later in the first quarter of 2021, according to market so...
Monday 4 January 2021
SMIC reportedly gets US license for mature manufacturing process
China's SMIC has reportedly received US licenses to import equipment for use in mature-node processes, which may help relieve the global 8-inch foundry capacity shortages, according...
Thursday 31 December 2020
Taiwan display driver IC firms remain upbeat about 2021
Taiwan-based display driver IC (DDI) suppliers who have raised quotes by 10-15% to reflect tight supply and rising costs remain upbeat about 2021, as market conditions will still...
Thursday 31 December 2020
Winbond expects new plant to come online in 2022
Winbond Electronics is constructing a new 12-inch wafer fab in Kaohsiung, southern Taiwan, which is scheduled to come online in the first half of 2022, according to the specialty...
Tuesday 29 December 2020
GlobalWafers to raise spot quotes for silicon wafers
GlobalWafers has run all its production lines for 12-, 8- and 6-inch silicon wafers at full capacity, according to company chairperson Doris Hsu. The silicon wafer supplier plans...
Monday 28 December 2020
China moving to prevent blind investment in third-generation semiconductors
China plans to invest big to build its homegrown third-generation compound semiconductors sector, but is also moving to prevent blind investments by Chinese players, asking them to...
Wednesday 23 December 2020
Innolux to enter IC packaging field with FOPLP process
Panel maker Innolux is looking to venture into the IC packaging segment by converting its 3.5G LCD panel fab into an advanced packaging plant dedicated to FOPLP (fan-out panel level...
Wednesday 23 December 2020
Taiwan IC ecosystem unscathed by Huawei ban
The impact of Huawei's woes on its Taiwan-based chip suppliers has been smaller than expected, according to industry sources.
Tuesday 22 December 2020
Tyntek to start 6-inch wafer production
Vertically-integrated LED maker Tyntek has completed 6-inch epitaxial wafer production capacity for producing customized Si-based sensor chips mainly, and expects to gradually obtain...
Monday 21 December 2020
Ventec sees auto thermal materials as main growth engine in 2021
Ventec International expects shipments of automotive thermal materials and high-end specialty CCL materials for military and aerospace applications to remain major growth drivers...