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NEWS TAGGED TONG HSING ELECTRONIC INDUSTRIES
Monday 13 September 2021
IDMs, Foxconn, BYD deepening deployments in GaN, SiC devices
International IDMs, Taiwan's EMS leader Foxconn and China's semiconductor and EV vendor BYD Group are all keenly deepening their deployments in third-generation semiconductors GaN...
Friday 10 September 2021
Foxconn to make SiC components at 6-inch fab for EV, solar apps
Foxconn (Hon Hai) Technology Group has disclosed that at its newly-acquired 6-inch wafer fab in Hsinchu, northern Taiwan, the company will be making SiC components and IR MEMS sensors...
Tuesday 24 August 2021
Tong Hsing to open new plant in 2022 for processing car CIS, SiC chips
Tong Hsing Electronic Industries, which supplies ceramic substrates and backend services for CMOS image sensors (CIS) and other niche ICs, has held a beam-raising ceremony for its...
Monday 23 August 2021
Taiwan suppliers bracing for new business opportunities from SpaceX
There is still quite some distance to commercialization of satellite communications, but Taiwan makers in the supply chain of Starlink, an Internet satellite project by SpaceX, are...
Tuesday 17 August 2021
Backend houses enjoy strong influx of orders for automotive CIS
Taiwan-based backend houses, including Tong Hsing Electronic Industries, King Yuan Electronics (KYEC), and Xintec, have seen orders from international IDMs continue ramping up for...
Wednesday 14 July 2021
Taiwan CIS backend firms to embrace strong 2H21
Backend houses including Xintec, ShunSin Technology and Tong Hsing Electronic Industries are expected to post brisker sales results for the second half of 2021 after posting impressive...
Tuesday 29 June 2021
MIH may stretch into autonomous driving
MIH Consortium, a Foxconn-led open EV ecosystem, may extend its business tentacle into the self-driving segment as quite a few startups from the segment are now members of the alliance...
Thursday 24 June 2021
Foxconn plowing deeper into semiconductor and EV
Foxconn (Hon Hai) Technology Group has recently acquired a 5.03% stake or 120 million shares in Malaysia-based Dagang NeXchange (DNeX) for around NT$720 million (US$25.78 million)...
Thursday 17 June 2021
Tong Hsing to expand packaging capacity for automotive CIS
Backend house Tong Hsing Electronic Industries plans to expand production capacity in three phases for automotive CMOS image sensors (CIS), while Chinese peers are also enforcing...
Monday 26 April 2021
Tong Hsing to raise quotes for ceramic substrates later in 2Q21
Taiwan's backend house Tong Hsing Electronic Industries is set to raise quotes for ceramic substrates later in the second quarter of the year in response to increasingly strong demand...
Wednesday 7 April 2021
Strong sensor demand to buoy suppliers in 2021
Demand for CMOS image sensor (CIS) and other sensors is set to be robust this year, driven by a surge in demand for video conferencing, security surveillance and automotive electronics...
Thursday 18 March 2021
Taiwan III-V players to explore RF, PA demand for satellites
Taiwan's backend houses and III-V semiconductor suppliers are poised to explore business opportunities for RF and PA modules for space communication applications, demand for which...
Tuesday 16 March 2021
Backend firms to gain growth momentum from car chips till 3Q21
Taiwan's backend service firms will see their ratios of revenues from processing automotive chips ramp up through at least the third quarter 2021, according to industry sources.
Wednesday 10 March 2021
Taiwan OSATs post revenue increases in February
Taiwan-based OSAT providers including ASE Technology, King Yuan Electronics (KYEC) and Tong Hsing Electronic Industries have posted on-year revenue increases for February 2021, and...
Monday 25 January 2021
CIS chip suppliers tapping lucrative automotive, surveillance sectors
CMOS image sensor (CIS) suppliers are shifting their marketing strategies to focus more on automotive and surveillance applications seeking to ramp up profitability, according to...