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NEWS TAGGED TOKYO ELECTRON
Thursday 1 July 2021
Six-inch fabs become acquisition target
Six-inch wafer fabs have become acquisition targets of automotive power semiconductor companies, as well as Foxconn Electronics (Hon Hai Precision Industry) and Tesla, both of which...
Wednesday 9 June 2021
Tokyo Electron to collaborate with imec-ASML joint high NA lab
Tokyo Electron has announced the company will introduce its leading-edge Coater/Developer to the imec-ASML joint high NA EUV research laboratory (joint high NA lab) in Veldhoven,...
Tuesday 30 March 2021
Chipmaking equipment and materials suppliers looking to beef up operations in Taiwan
Japan-based semiconductor equipment vendor Tokyo Electron is reportedly eyeing the acquisition of a 6-inch wafer fab in Taiwan that has been put up on sale, while fellow companies...
Tuesday 22 December 2020
Major IC equipment, materials vendors deepening presence in Taiwan
Many international semiconductor equipment and materials suppliers have been stepping up investments or strengthening deployments in Taiwan seeking to better serve TSMC's ecosystem...
Friday 6 December 2019
TSMC to kick off 3nm process manufacturing in 2022
TSMC is firmly on track to move 5nm process technology to commercial production in the first half of 2020 and will kick off production of chips built using a newer 3nm process node...
Thursday 14 November 2019
TSMC to build advanced packaging fab in northern Taiwan in 2020
TSMC's planned advanced packaging plant in Miaoli, Northern Taiwan has passed environmental impact assessment, enabling the foundry house to kick off construction of the new fab in...
Thursday 2 August 2018
Advantech works with Tokyo Electron Device to promote edge computing for AIoT
Advantech has disclosed it is working to strengthen its partnership with Tokyo Electron Device (TED) in striving to promote edge computing. With the aim of transforming the conventional...
Friday 22 September 2017
Tokyo Electron optimistic about etching equipment demand for 3D NAND, FinFET
Etching equipment demand for the manufacture of 3D NAND flash memory and FinFET chips is expected to grow in 2018 and 2019, according to Tokyo Electron, which expects its share of...
Wednesday 23 August 2017
Winbond announces equipment purchases
Winbond Electronics, a memory chipmaker specializing in specialty DRAM and flash memory chips, has disclosed two purchases of machinery equipment from Lam Research and Tokyo Electron...
Tuesday 18 July 2017
TSMC expanding number of equipment suppliers for 7nm
Taiwan Semiconductor Manufacturing Company (TSMC) is expanding the number of suppliers of equipment for its 7nm process in a bid to maintain an ecosystem pricing balance, according...
Tuesday 6 June 2017
TSMC orders equipment for NT$3 billion
Pure-play foundry Taiwan Semiconductor Manufacturing Company (TSMC) on June 5 disclosed a total of about NT$3.09 billion (US$102.8 million) spent on machinery equipment from ASML,...
Thursday 6 April 2017
TSMC orders equipment for nearly NT$5 billion
Pure-play foundry Taiwan Semiconductor Manufacturing Company (TSMC) on April 5 disclosed a total of nearly NT$5 billion (US$164.4 million) spent on machinery equipment from ASML and...
Tuesday 27 December 2016
Winbond orders equipment for NT$1.71 billion
Winbond Electronics has disclosed two purchases of machinery equipment from KLA-Tencor and Tokyo Electron for a total of NT$1.71 billion (US$52.87 million), according to company filings...
Tuesday 27 December 2016
TSMC buys equipment for NT$9.74 billion
Pure-play foundry Taiwan Semiconductor Manufacturing Company (TSMC) has spent a total of NT$9.74 billion (US$301.96 million) on equipment from six suppliers, according to filings...
Wednesday 21 December 2016
TSMC buys equipment for NT$6.57 billion
Pure-play foundry Taiwan Semiconductor Manufacturing Company (TSMC) has spent a total of NT$6.57 billion (US$123.4 million) this week on equipment from eight suppliers, according...