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Friday 17 September 2021
Highlights of the day: International EV and semiconductor makers team up for SiC modules
Following in the footsteps of International IDMs and automakers to promote their SiC components for EVs, China auto and...
Thursday 16 September 2021
GF, Qualcomm team up for advanced 5G RF front-end devices
GlobalFoundries (GF) has announced the foundry is continuing its partnership with Qualcomm, expanding their RF collaboration on 5G multi-Gigabit speed RF front-end products.
Friday 10 September 2021
Memory price growth to lose momentum in 4Q21, says Team Group
Memory price growth is poised to lose momentum in the fourth quarter of 2021, as chip suppliers, and downstream distributors and module houses see their deliveries disrupted by the...
Friday 20 August 2021
DRAM contract prices likely to drop 5-10% in 4Q21, says Team Group
DRAM contract prices are likely to fall 5-10% in the fourth quarter of 2021, and continue their slight drops through the second quarter of next year, according to CW Chen, president...
Wednesday 11 August 2021
Taiwan government and enterprises should team up for talent cultivation, says Etron chair
Built upon its solid foundation, Taiwan's semiconductor industry is gearing up for its next stage of development. A shortage of engineers and other professionals remains a challenge...
Wednesday 7 July 2021
Swancor forms Taiwan team for developing offshore wind farms
Swancor Renewable Energy has disclosed it has partnered with Tien Li Offshore Wind Technology, Yeong Guan Energy Technology and J&V Energy Technology to form a Taiwan team for...
Wednesday 9 June 2021
Tokyo Electron to collaborate with imec-ASML joint high NA lab
Tokyo Electron has announced the company will introduce its leading-edge Coater/Developer to the imec-ASML joint high NA EUV research laboratory (joint high NA lab) in Veldhoven,...
Wednesday 2 June 2021
US, France healthcare startups team up with Taiwan to drive growth in Asia
As COVID-19 continues to hamper international interactions, two startups from the US and France collaborating with BE Health in Taiwan have closed venture capital funding rounds recently...
Thursday 1 April 2021
Himax, BOEVx team up for automotive AMOLED display solutions
Himax Technologies, a vendor of driver ICs, has announced it has teamed up with BOE Varitronix (BOEVx), a supplier of car-use display products, to develop flexible AMOLED automotive...
Thursday 1 April 2021
Team Group posts profit hike on record revenue in 2020
Memory module house Team Group saw its net profit jump more than tenfold on year to NT$141 million (US$5 million) in 2020, with revenue hitting a record high of NT$7.5 billion. EPS...
Tuesday 30 March 2021
IC equipment vendor KLA to boost local team in Taiwan
US-based semiconductor equipment vendor KLA is looking to beef up its operations in Taiwan with plans to hire an additional 100 staff this year.
Tuesday 16 March 2021
Globalfoundries, Bosch team up for next-gen automotive radar technology
Globalfoundries has announced it is partnering with Bosch to develop and manufacture next-generation automotive radar technology, according to the companies.
Friday 26 February 2021
Wistron, Chunghwa Telecom team up to tap 5G, AI service sectors
Wistron Group has forged a strategic alliance with Chunghwa Telecom (CHT) to jointly tap business opportunities arising from proliferating 5G and AI applications.
Tuesday 29 December 2020
Team Group to put increased focus on gaming, industrial in 2021
Team Group will put increased focus on the gaming and industrial control segments in 2021, when market conditions will be also favorable to the memory module maker, according to the...
Friday 27 November 2020
NCKU team develops digital imaging solutions in liver pathology leveraging AI technology
The pathologist, specialized in looking at tissue or pathological sections through a microscope, is to make a definitive cancer diagnosis and may also work with physicians or other...