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NEWS TAGGED TDDI
Thursday 22 July 2021
HiSilicon faces difficulty gaining manufacturing support for OLED DDI
HiSilicon is gearing up in-house development of OLED display driver chips (DDI), but has encountered difficulty in gaining sufficient support from foundries and OSATs capable of providing...
Wednesday 16 June 2021
Hermes Testing poised to tap cantilever probe card market
Hermes Testing Solutions (HTSI), a unit of chipmaking equipment supplier Hermes-Epitek, is poised to develop and manufacture cantilever probe cards with the technology already transferred...
Monday 24 May 2021
OSATs may further hike service quotes in 3Q21
Taiwan OASTs are expected to enforce a new round of quote hikes in the third quarter of the year to reflect ever-rising prices for raw materials particularly for QFN wire-bonding...
Thursday 20 May 2021
Backend houses see strong demand for display peripheral ICs
Backend demand for display peripheral ICs, such as T-Con and TDDI chips, has been robust, and major OSATs such as ASE Technology and Greatek Electronics are busy processing such chips...
Friday 23 April 2021
Novatek ramping up 28nm wafer starts at UMC
Novatek Microelectronics has placed significant orders for OLED display driver ICs with United Microelectronics (UMC) demanding 28nm process technology, according to industry sourc...
Friday 16 April 2021
TSMC reportedly raises quotes for mature processes
TSMC has adjusted upward its quotes for mature processes, prompting suppliers particularly LCD driver IC firms to also raise their chip prices, according to industry sources.
Thursday 15 April 2021
Taiwan LCD driver IC firms to post profit gains in 2Q21
Taiwan-based LCD driver IC suppliers have already notified their customers about price hikes of 10-20% or more for their TDDI and other DDI chips starting April, and are poised to...
Thursday 15 April 2021
CHPT cuts into supply chain for TV SoCs with new probe cards
Chunghwa Precision Test Technology (CHPT) with its latest in-house developed probe cards has obtained new orders demanding circuit probing for TV SoC chips, according to the Taiwan-based...
Friday 19 March 2021
IC designers may hike quotes to reflect further foundry cost increases
Taiwan's IC design houses will have no other choice but to directly pass increased costs to downstream clients if their foundry partners raise quotes again in the second half of the...
Wednesday 17 March 2021
ChipMOS expects double-digit sales growth in 2021
Taiwan's display driver IC (DDI) backend specialist ChipMOS Technologies expects to post a double-digit revenue growth in 2021 with better profits than 2020, driven by robust DDI...
Wednesday 10 March 2021
Packaging materials vendors gaining from strong DDI demand
Packaging materials suppliers have seen a surge in orders from display driver IC (DDI) backend specialists, and are poised to enjoy strong DDI demand throughout 2021, according to...
Thursday 4 March 2021
CHPT rolls out new solutions for handset APs, HPC chips
IC testing interface solution provider Chunghwa Precision Test Tech (CHPT) has rolled out new solutions designed for handset application processors and HPC chips, according to industry...
Friday 19 February 2021
Tape COF substrate demand picking up
Taiwan-based Chipbond Technology and JMC Electronics have both seen orders for tape COF substrates pick up substantially, reflecting limited capacity supply for such substrates and...
Wednesday 17 February 2021
Backend houses to thrive on strong demand for 5G, Wi-Fi 6 chips in 2021
Taiwan's IC backend supply chain players are poised to embrace another robust year in 2021 driven by strong demand for 5G and Wi-Fi 6 applications, after logging full capacity utilization...
Tuesday 9 February 2021
Chipbond, ChipMOS to enjoy strong 1H21
Display driver IC backend specialists Chipbond Technology and ChipMOS Technologies are both poised to enjoy a strong first half of 2021, driven by continued strong demand for small-size...