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306 news items tagged substrate

  • Chang+Wah+Technology+chairman+CN+Huang
    Chances are not high for leadframe suppliers to score double-digit revenue increases in 2019, and China leadframe supply chain can hardly emerge to threaten Taiwan peers, according...
  • Unimicron swings to profit in 3Q18

    Friday 16 November 2018
    PCB and IC substrate supplier Unimicron Technology swung to net profits of NT$982 million (US$31.8 million) in the third quarter of 2018 from losses in the prior quarter and a year...
  • JMC Electronics, an affiliate of Chang Wah Electromaterials (CWE) specializing in the manufacture of chip-on-film (COF) substrates, has enjoyed robust orders for Android smartphones...
  • Chipbond posts record 3Q18 profit

    Thursday 1 November 2018
    LCD driver IC backend specialist Chipbond Technology has reported net profits climbed to a record high of NT$2.71 billion (US$87.6 million) in the third quarter of 2018. EPS for the...
  • Taiwan-based Flexium Interconnect and Unimicron Technology have both been fined for violating environmental regulations in Kunshan, China.
  • ABF substrate supply becomes tight

    Friday 28 September 2018
    The supply of ABF (ajinomoto build-up film) substrates has become tight, thanks to growing demand for server and high-performance computing applications, according to industry sour...
  • chip
    Taiwan IC backend service firms have seen increasing flip-chip packaging orders from China chipmaker HiSilicon now actively carrying out volume production of pre-5G chip products,...
  • Nanya PCB striving to cut loss

    Thursday 23 August 2018
    Nanya Printed Circuit Board is striving to lower its operating losses by developing high-margin products such as those for automotive electronics, 5G and AI applications, according...
  • Driver IC backend specialists have inked supply deals with several of their fabless clients, and have promised sufficient capacity for COF (chip-on-film) packaging over the next three...
  • Unimicron Technology (Kunshan), a subsidiary of Taiwan-based PCB and IC substrate manufacturer Unimicron, has been fined CNY380,000 (US$55,520) for breaking local environmental laws,...
  • Chip on film (COF) packaging substrate supplier JMC Electronics and COF back-end service firms Chipbond Technology and ChipMOS Technologies are set to enjoy brisk sales in the second...
  • Copper clad laminate (CCL) supplier Ventec International plans to apply for listing on the Taiwan Stock Exchange (TWSE) mainboard in the first quarter of 2019, according to company...
  • yageo
    Taiwan leading passive component maker Yageo will still do its best to satisfy customer demand for standard-type MLCCs for consumer devices despite its enhanced deployments in niche-type...
  • corning
    Corning has unveiled its new 10.5G LCD glass substrate manufacturing facility co-located with the BOE Technology Group (BOE) plant in the Hefei Xinzhan Hi-Tech Industrial Development...
  • Taiwan OSAT (outsourced semiconductor assembly and test) firms are facing headwinds in striving for flip-chip packaging orders for cryptocurrency mining ASICs, as the sharp price...
  • The global semiconductor packaging materials market reached US$16.7 billion in 2017, according to a report by SEMI and TechSearch International. While slower growth of smartphones...
  • Chip-on-film (COF) packaging demand will start to grow substantially in the second half of 2018, driven by the arrival of new smartphones featuring an edge-to-edge display, according...
  • ASE-TDK JV start operations

    Monday 5 March 2018
    ASE Embedded Electronics, a joint venture between Advanced Semiconductor Engineering (ASE) and TDK, has started operations.
  • ASE+COO+Tien+Wu+gives+optimistic+outlook+for+2018
    Advanced Semiconductor Engineering (ASE) expects its IC backend business sales to register strong sequential growth in the second quarter and grow through the fourth quarter. The...
  • Kinsus profits shrink in 2017

    Tuesday 30 January 2018
    IC substrate supplier Kinsus Interconnect Technology's net profits fell 78% on year to NT$491 million (US$16.8 million) in 2017. EPS for the year came to NT$1.10, down from NT$5.01...
  • Kinsus posts record October revenues

    Tuesday 7 November 2017
    IC substrate supplier Kinsus Interconnect Technology saw its October revenues climb to a record high of NT$2.48 billion (US$82.3 million).
  • Kinsus 1Q-3Q17 net profits fall

    Wednesday 1 November 2017
    IC substrate supplier Kinsus Interconnect Technology has reported net profits of NT$476 million (US$15.8 million) for the first three quarters of 2017, down 72.7% on year, with EPS...
  • IC substrate maker Kinsus Interconnect Technology is expected to enjoy an up to 20% sequential increase in fourth-quarter 2017 revenues, driven mainly by a ramp-up of orders for substrate-like...
  • IC substrate maker Kinsus Interconnect Technology has reported net profits for the first half of 2017 declined 82.1% from a year earlier to NT$199 million (US$6.6 million). EPS for...
  • Tong Hsing Electronic Industries, which provides assembly and packaging services for CMOS image sensors as well as other niche ICs, started shipments for 3D sensing products in small...
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