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Monday 17 January 2022
Taiwan MCU makers to ramp up shipments for non-consumer segments in 2Q22
Taiwan-based MCU vendors, including Nuvoton Technology, Megawin Technology, Holtek Semiconductor, and Nyquest Technology, are poised to see their shipments for industrial applications...
Thursday 16 December 2021
Taiwan chipmakers gearing up for WBG semiconductors
Taiwan-based chipmakers, led by foundry TSMC and silicon wafer supplier GlobalWafers, are gearing up to tap into the market for gallium nitride (GaN), silicon carbide (SiC) and other...
Friday 5 November 2021
Taiwan chipmakers gearing up for automotive IC boom
Taiwan-based foundries and IC design houses are looking to expand their presence in the automotive electronics sector, where chip demand is set to grow robustly, according to industry...
Monday 1 November 2021
STMicro 3Q21 revenue reflects strong global chip demand
STMicroelectronics (ST) recently released its third-quarter financial results. Revenue in 3Q reached US$3.19 billion with a net income of US$474 million. Despite being slightly lower...
Thursday 21 October 2021
IC design houses see clients increasingly reluctant to accept price hikes
Taiwan-based IC design houses, particularly those engaged in consumer ICs, have come under increasing pressure to maintain their quotes for 2022 as customers are more reluctant to...
Thursday 21 October 2021
Automotive IDMs to raise chip prices by 10-20% in 2022
Automotive IDMs have notified their clients about 10-20% price hikes for their chips starting 2022 as they continue to face mounting costs for raw materials, according to industry...
Thursday 14 October 2021
Power and compound fab capacity to top 10 million wafers monthly in 2023, says SEMI
Fueled by pent-up demand for automotive electronics caused by semiconductor supply chain disruptions, worldwide installed capacity for power and compound semiconductor fabs is projected...
Thursday 7 October 2021
Tongfu to raise CNY5.5 billion for capacity expansions
China-based OSAT Tongfu Microelectronics plans to raise up to CNY5.5 billion (US$854 million) to fund its upcoming capacity expansions for a variety of segments, according to industry...
Friday 1 October 2021
STMicro, Xilinx to raise chip prices in 4Q21
STMicroelectronics and Xilinx have both notified their clients about price increases for their chip solutions starting the fourth quarter of 2021, which is expected to fuel a new...
Friday 24 September 2021
IDMs step up deployments in GaN, SiC devices
IDMs including TI, Infineon, STMicroelectronics and Microchip have all stepped up their deployments in the market for power devices using GaN, SiC and other third-generation semiconductor...
Friday 17 September 2021
China stepping up deployments in homegrown car-use SiC modules
China auto and semiconductor makers are stepping up the development and production of their homegrown SiC chips and modules for EV applications, according to industry sources.
Tuesday 7 September 2021
IDMs migrate to 8-inch wafer fabrication for 3rd-gen semiconductors
IDMs including Infineon, Rohm and STMicroelectronics are transitioning to 8-inch wafer fabrication for third-generation semiconductors such as GaN and SiC, according to industry so...
Tuesday 31 August 2021
TSMC launches advanced packaging for silicon photonics applications
TSMC has introduced its new advanced packaging technology dubbed COUPE (compact universal photonic engine) heterogeneous integration technology for silicon photonic ASICs targeting...
Wednesday 25 August 2021
Leadframe demand for car power modules promising in next 2-3 years
Taiwan-based leadframe makers Shuen Der Industry (SDI) and Jih Lin Technology are optimistic about shipments for automotive power components and modules over the next two to three...
Tuesday 13 July 2021
Malaysia lockdown could worsen global IC shortage
A nationwide lockdown in Malaysia has made disruptions to the output from local chip plants, which fulfill mainly orders for entry-level and mid-range logic ICs, and power diodes...
Tuesday 5 December 2017
ST PWD13F60
STMicroelectronics' PWD13F60 system-in-package (SiP) contains a complete 600V/8A single-phase MOSFET full bridge in a 13mm x 11mm outline, saving bill-of-materials costs and board space in industrial motor drives, lamp ballasts, power supplies, converters, and inverters, according to the company. With a footprint 60% smaller than a comparable circuit built from discrete components, the PWD13F60 can also boost end-application power density, according to STMicro. By integrating four power MOSFETs, it presents an alternative to other modules on the market that are typically dual-FET half-bridge or six-FET three-phase devices. Unlike either of these choices, only one PWD13F60 is needed to implement a single-phase full bridge, leaving no internal MOSFETs unused. There is also flexibility to configure the module as one full bridge or two half bridges. Leveraging ST's high-voltage BCD6s-offline fabrication process, the PWD13F60 integrates gate drivers for the power MOSFETs and the bootstrap diodes needed for high-side driving, which simplifies board design and streamlines assembly by eliminating external components. The gate drivers are optimized for reliable switching and low EMI (electromagnetic interference). The SiP also features cross-conduction protection and under-voltage lockout, which helps further minimize footprint while ensuring system safety. The PWD13F60 supports a supply-voltage range extending down to 6.5V for maximum flexibility. In addition, the SiP inputs can accept logic signals from 3.3V to 15V to ensure interfacing with microcontrollers (MCUs), digital signal processors (DSPs), or Hall sensors.