中文網
Taipei
Tue, Jul 5, 2022
08:18
partly cloudy
26°C
CONNECT WITH US
NEWS TAGGED SIP
Thursday 24 June 2021
BT substrate suppliers kicking off shipments for new Apple devices
BT substrate vendors in the supply chain of Apple devices are all gearing up shipments for next-generation Apple Watch, AirPods and iPhone devices, which will all massively adopt...
Thursday 24 June 2021
New Apple Watch reportedly to adopt double-sided SiP for PMICs
The upcoming Apple Watch series reportedly will massively adopt double-sided SiP packaging for power management ICs, with ASE Technology as the main backend partner, according to...
Tuesday 22 June 2021
BT substrate supply may fall short of demand in 2H21
The supply of BT substrates is likely to fall short of demand in the second half of this year, but the shortage will be less severe than that of ABF substrates, according to industry...
Friday 18 June 2021
ShunSin gearing up for 400G transceiver module packaging services
Backend house ShunSin Technology, a subsidiary of Foxconn Technology (Hon Hai Precision) specializing in system-in-package (SiP) modules, is poised to reap handsome income by rendering...
Friday 11 June 2021
ASE Technology posts record revenues for May
ASE Technology has reported revenue grew 2.3% sequentially and about 18% on year to NT$42.27 billion (US$1.53 billion) in May 2021, a record high for the same month, and its January-May...
Friday 4 June 2021
Texas Instruments remains top analog IC supplier
With analog sales of US$10.9 billion and 19% marketshare, Texas Instruments (TI) maintained its firm grip as the leading supplier of analog devices in 2020, according to IC Insights...
Wednesday 2 June 2021
AiP, 3D IC packaging increasingly adopted for 5G mmWave, HPC chips
With more mmWave-capable and HPC chip designs being developed, AiP, 3D stacking and other advanced packaging technologies will be increasingly needed for commercial applications,...
Tuesday 25 May 2021
ASE promotes embedded die packaging for automotive electronics
Backend house ASE Technology will have its in-house developed embedded die technology, dubbed "Advanced Embedded Active System Integration (aEASI)," mainly applied to processing automotive...
Tuesday 25 May 2021
Taiwan testing houses gearing up for AiP, 3nm chips
Taiwan-based IC testing houses including King Yuan Electronics (KYEC), Sigurd Microelectronics and Ardentec have all kicked off R&D for more advanced 3nm-made chips, while also...
Monday 24 May 2021
Inspection equipment vendor TRI upbeat about 2021 sales
Taiwan's testing and inspection equipment vendor Test Research (TRI) is optimistic its 2021 business results will be better than 2020, driven by strong equipment demand for 5G, notebook...
Friday 7 May 2021
BT substrate supply increasingly tight on strong cryptomining demand
The supply of BT substrates has been increasingly tight, as more vendors of chips, particularly cryptomining ASICs, have turned to adopt BT substrates amid worsening shortages of...
Wednesday 28 April 2021
PTI sees clear order visibility through 3Q21
Backend house Powertech Technology (PTI) and along with its logic IC packaging subsidiary Greatek Electronics have seen clear order visibility through the third quarter of 2021, with...
Friday 23 April 2021
ASE lands FC-AiP orders for new iPad Pro
ASE Technology Holding will see its FC-AiP (antenna in package) business receive a significant boost in the months ahead as the company and its EMS subsidiary Universal Scientific...
Friday 26 March 2021
FPCB, SiP substrate makers readying mass production for new AirPods
Taiwan's PCB makers in the supply chain of AirPods are prepared to kick off mass production of flexible PCB (FPCB) and SiP substrates for the third-generation AirPods slated to be...
Friday 26 March 2021
ASE starts optical sensors production for next-generation AirPods
Backend house ASE Technology has kicked off optical sensors production for the next-generation AirPods slated for launch in the third quarter of 2021, according to industry sources...