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Wednesday 1 September 2021
ASE, PTI making progress in PLP field
ASE Technology and Powertech Technology (PTI) have both stepped up their deployments in the panel-level packaging (PLP) field, and are involved in multiple computing chip design projects,...
Monday 30 August 2021
BT substrate demand for wire-bonding, memory chips to stay strong till 1Q22
BT substrates for wire-bonding use or memory chips processing are expected to stay in robust demand till at least the first quarter of 2022, and those for processing higher-end handset...
Tuesday 24 August 2021
China OSATs strengthen QFN packaging capability for car chips
China-based OSATs including JCET, Tongfu Microelectronics and Tianshui Huatain Technology have all moved to enhance their QFN (quad flat no-lead) packaging capability for automotive...
Wednesday 18 August 2021
Shennan Circuits to build production capacity for ABF substrates
China-based PCB maker Shennan Circuits has disclosed plans to invest a total of CNY6 billion (US$925.3 million) in building production lines for ABF substrates, making it the first...
Friday 13 August 2021
IC shortage to remain challenging in 2022, says ASE
A shortfall in the supply of ICs will persist and remain a challenge facing businesses in 2022, according to OSAT market leader ASE Technology.
Friday 13 August 2021
ASE, ShunSin poised to embrace growing SiP demand
OSATs with SiP (system-in-package) technology, including ASE Technology and ShunSin Technology, are poised to gain from the ever-growing SiP demand for integrating heterogeneous chips...
Tuesday 3 August 2021
China PCB maker DSBJ to step into IC substrate market
China's PCB maker Dongshan Precision Manufacturing (DSBJ) has disclosed plans to invest CNY1.5 billion (US$232.1 million) in establishing a new wholly-owned subsidiary that will be...
Wednesday 28 July 2021
IC substrate maker Kinsus posts 2-fold profit jump in 2Q21
IC substrate maker Kinsus Interconnect Technology saw its net profits for second-quarter 2021 shoot up 202% on year to NT$1.01 billion (US$36.1 million), thanks to substantial improvements...
Wednesday 28 July 2021
Foxconn installs advanced packaging equipment at China plant
Foxconn Technology (Hon Hai Precision Industry) has started installing equipment including lithography systems for high-end IC packaging at its chip plant in Qingdao, northeast China,...
Friday 23 July 2021
PCB firms shipping in small volumes for upcoming AirPods
Shipments of flexible PCBs (FPCB) and SiP modules for use in the next-generation AirPods have kicked off in small volumes, and will be scaled up between late third-quarter and fourth-quarter...
Monday 12 July 2021
ASE Technology to score big in 3Q21 from serving heavyweights
Taiwan's leading OSAT ASE Technology Holding will see big orders from major clients Apple, Qualcomm and MediaTek further power its revenue growth in the third quarter after posting...
Thursday 8 July 2021
Arrival of new capacity drives Nan Ya, Kinsus revenue growth
Nan Ya PCB and Kinsus Interconnect Technology both saw their June revenue climb over 30% from a year earlier, driven mainly by the arrival of new production capacity, according to...
Friday 2 July 2021
Zhen Ding to set up 4 new plants mainly for IC substrates, HDI boards
Taiwan's PCB maker Zhen Ding Technology has disclosed plans to set up four new plants in Taiwan and China in 2021, mostly dedicated to production of high-end IC substrates and rigid...
Wednesday 30 June 2021
Apple reportedly enlists five suppliers of AiP substrates for new mmWave iPhnones
Apple reportedly has enlisted AT&S as a new supplier of BT-based AiP (antenna in package) substrates for new 5G mmWave iPhones to be released later in the year, expanding to five...
Friday 25 June 2021
IC substrate makers see supply stay tight despite cryptomining slowdown
IC substrate makers continue to see their output fall short of demand, despite a recent slowdown in cryptomining demand, according to industry sources.