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Thursday 25 November 2021
TSMC outsources part of CoWoS packaging production to OSATs
TSMC has outsourced part of its chip-on-wafer-on-substrate (CoWoS) packaging to OSATs including Advanced Semiconductor Engineering (ASE), Siliconware Precision Industries (SPIL) and...
Friday 12 November 2021
Nan Ya PCB expects double-digit revenue growth in 2022
Taiwan-based Nan Ya PCB is optimistic that its 2022 revenues will register another double-digit growth on new ABF and BT production capacities gradually coming online.
Tuesday 9 November 2021
Na Ya posts record revenues for October on strong sales of electronics, chemical materials
Taiwan-based Nan Ya Plastics has reported its October revenues grew 4.9% sequentially and 51.4% on year reaching a record monthly high of NT$37.45 billion (US$1.343 billion).
Friday 29 October 2021
IC backend quotes to stay favorable to OSATs in 2022, says ASE
ASE Technology expects market conditions in 2022 to remain favorable to it and other OSATs, and is upbeat about its ASP growth next year as automotive chips wirebonding business and...
Thursday 28 October 2021
'SysMoore' or 'More than Moore': Semiconductor technologies likely to evolve with system complexity
The sustainability of Moore's Law, an observation made by Gordon Moore in 1965 that the number of transistors on a chip would double every 18 months, has been in the center of debate...
Wednesday 20 October 2021
Taiwan IC substrate makers cut into supply chain for new-gen Mac chips
Taiwan-based IC substrate suppliers, such as Unimicron Technology, have reportedly cut into the supply chain for Apple's custom-built silicon powering the next generation Macs, and...
Wednesday 6 October 2021
Kunshan plants hit by power cuts, but Nan Ya ABF substrate fab unaffected
Taiwan-based makers with factory operations in Kunshan of China's Jiangsu provinces were notified on October 5 by the local government about immediate power cuts, and have expressed...
Friday 1 October 2021
ASE Technology launches MicroSiP solution dedicated for wearables
OSAT ASE Technology has launched MicroSiP packaging solutions designed specifically for TWS earbuds and other wearable devices, according to industry sources.
Thursday 30 September 2021
Taiwan OSATs grab huge orders from Renesas
OSATs including Ardentec, ASE Technology, King Yuan Electronics (KYEC) and Powertech Technology (PTI) have landed significant backend orders for automotive MCUs from Japan's Renesas...
Friday 17 September 2021
Chipmakers working with partners to step up deployments in 5G RF devices
Fabless chipmakers are looking to step up their deployments in the 5G RF front-end module (RF FEM) and other device markets by working closely with their manufacturing partners, according...
Friday 17 September 2021
AiP packaging demand set to be stimulated by new iPhone
With the new-generation iPhones equipped with more antenna-in-package (AiP) modules, AiP packaging demand will be rising along with the iPhone sales, according to industry sources.
Thursday 16 September 2021
Backend firms to see strong 5G RF module demand for iPad mini 6
Backend houses including ASE Technology and Chipbond Technology are poised to enjoy robust orders for processing 5G RF modules, driven by demand for Apple's just-unveiled iPad mini...
Friday 10 September 2021
Unimicron reports record August revenue
IC substrate and PCB maker Unimicron Technology enjoyed another month of record-high revenue in August, driven by robust orders and rising ASPs.
Wednesday 8 September 2021
Kinsus to enjoy sales growth through 4Q21
IC substrate maker Kinsus Interconnect Technology is expected to post sequential revenue increases through the fourth quarter of 2021, buoyed by strong ABF and BT based substrate...
Monday 6 September 2021
UMC, Chipbond to form partnership through share swap
Pure-play foundry United Microelectronics (UMC) has announced plans to form a strategic partnership with Chipbond Technology, a display driver IC (DDI) backend specialist, through...